SUSS MicroTec
MJB 4 Mask
The SUSS MJB 4 mask aligner supports vacuum, hard, soft, and proximity contact exposures, processing substrates up to 4 inches in diameter. The MJB 4 is equipped with 400 nm exposure optics and lamps that allow sub-micron exposure in vacuum contact. The MJB 4 has a typical pattern resolution of 1 µm and an achievable alignment resolution of 1 µm.[1]
Power
Suss Power Supply[5]
Vacuum
vacuum, hard, soft proximity contact[1]
Performance
Front side Alignment[5]
Gas delivery
positive and negative[1]
Optics
Dual 5X & 10X Objectives[5]
What it is
The equipment provides topside alignment only and supports substrate sizes up to 4 inches in diameter.[1]
How it works
The MJB 4 is equipped with 400 nm exposure optics and lamps that allow sub-micro exposure in vacuum contact. The exposure can be performed in vacuum, hard, soft, or proximity contact modes.[1]
The achievable adjustment accuracy for X, Y, and theta is below 1 µm. The typical pattern resolution and achievable alignment resolution are both 1 µm. The minimum alignment mark separation for binocular vision is 3.5 cm.[1]
Where it fits in the process flow
The MJB 4 can process substrates up to 4 inches in diameter and accepts mask plates of 4 inch or 5 inch size. The total thickness of masks and substrates that can be processed is 9.00 mm.[1]
What do the numbers mean?
Power & electrical2
Vacuum & pumping3
Wafer handling6
Gas & chemistry1
Optics & imaging9
Performance6
- Front side Alignment[5]
Configuration & options2
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- Canon FPA 3000 i 5 + Fine Pattern— Same function class: Lithography, nullCompare in depthsource[7]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- ConfigurationSuss Power Supply[5]
- Exposure typesvacuum, hard, soft proximity contact[1]
- Lampsallowing sub-micron exposure in vacuum contact[1]
- Photoresist tonespositive and negative[1]
- Alignment features (as listed by reseller)front side alignment; trinocular split field microscope with dual 5X & 10X objectives; video camera; high resolution alignment; Suss power supply[5]
- Contact exposure modesvacuum, hard, soft, proximity contact[1]
Where are the manuals?
Publicly hosted documents referencing this tool, linked at their original location. Hosted by the linked institutions — availability may change.
- User ManualManualepfl.ch
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What substrate sizes can the MJB4 handle?
The MJB4 supports substrates up to 4 inches in diameter.[1]
What mask sizes are accepted?
The MJB4 accepts 4 inch or 5 inch mask plates.[1]
What alignment options are available?
The MJB4 provides topside alignment only, using a trinocular split-field microscope with dual 5X and 10X objectives.[5][1]
What is the typical resolution?
Typical pattern resolution is 1 µm, and achievable alignment resolution is 1 µm.[1]
What exposure modes does the MJB4 support?
The MJB4 supports vacuum, hard, soft, and proximity contact exposure modes.[1]
What is the total thickness capacity for masks and substrates?
The MJB4 can process masks and substrates with a total thickness of up to 9.00 mm.[1]
Not publicly documented
The following facts about the MJB 4 Mask are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the MJB 4 Mask are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the MJB 4 Mask are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the MJB 4 Mask are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the MJB 4 Mask are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the MJB 4 Mask is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (9)Every fact above is drawn from these public sources
- [1]cns1.rc.fas.harvard.edu — cns1.rc.fas.harvard.educns1.rc.fas.harvard.edu
- [2]Inventory photo
- [3]Inventory photo
- [4]Inventory photo
- [5]inventory listing
- [6]Equipment inventory listing
- [7]Equipment inventory listing
- [8]Süss MA6Gen3 ‒ Center of MicroNanoTechnology CMi ‐ EPFL — epfl.chepfl.ch
- [9]Imprint Lithography Equipment | SUSS MicroTec — suss.com (Jul 9, 2022)web.archive.org
Last updated Sep 23, 2026.
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Canon FPA 3000 i 5 + Fine Pattern is a lithography aligner described with a 6-inch wafer size.
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