Takatori
The Takatori WSD K 3 is a wire saw. The Takatori WSD K 3 is capable of handling substrates including silicon carbide (SiC), sapphire, quartz crystal and optical materials, and compound semiconductors (GaAs, GaN, InP).[1]
The Takatori WSD K 3 handles silicon carbide, sapphire, quartz crystal, optical materials, and compound semiconductors including GaAs, GaN, and InP.[1]
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
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The following facts about the WSD K 3 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the WSD K 3 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the WSD K 3 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the WSD K 3 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the WSD K 3 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the WSD K 3 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 5, 2026.
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