Temescal
8-pocket
The Temescal 8-pocket is an electron-beam evaporation system with an 8-pocket e-beam source. The Temescal 8-pocket uses a Temescal 10kV power supply and achieves a base pressure of approximately 5e-7 Torr. The Temescal 8-pocket supports up to 9 four-inch wafers in lift-off configuration and 18 four-inch wafers in sidewall coverage configuration.[1][2]
What it is
The Temescal 8-pocket uses an eight-pocket electron-beam source and is part of the deposition class of thin-film equipment.[2]
How it works
Where it fits in the process flow
Applications
The Temescal 8-pocket is used for n-type ohmic contact metalization to compound semiconductors, Schottky contacts to semiconductors, bond pads, and general metalization.[1][2]
- n-type ohmic contact metalization to compound semiconductors
- Schottky contacts to semiconductors
- bond pads
- general metalizations
What do the numbers mean?
Power & electrical1
Vacuum & pumping2
Wafer handling10
Control & software1
Configuration & options3
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What wafer sizes does the Temescal 8-pocket support?
The Temescal 8-pocket supports four-inch wafers, and one configuration also supports six-inch wafers.[1][2]
What is the wafer capacity in lift-off use?
The Temescal 8-pocket supports up to nine four-inch wafers in lift-off configuration.[1][2]
Not publicly documented
The following facts about the 8-pocket are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 8-pocket are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 8-pocket are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 8-pocket are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 8-pocket are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 8-pocket is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]wiki.nanotech.ucsb.edu — wiki.nanotech.ucsb.eduwiki.nanotech.ucsb.edu
- [2]8-pocket — Temescal | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
Last updated Oct 4, 2026.
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