Waferpedia

Temescal

FC-1800

DepositionTemescal FC-1800 family
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TemescalFC-1800
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  • Plate 01Temescal FC-1800 video showing loadlock, top chamber, bottom chamber

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  • Plate 02Temescal FC-1800

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  • Plate 03Temescal FC-1800 Automatic Deposition Process Demo - Part 1

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  • Plate 04Temescal FC-1800 E-Beam evaporator used semiconductor equipment

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  • Plate 05Temescal FC-1800 Auto Vent

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  • Plate 06Temescal FC-1800 Automatic Deposition Process Demo - Part 3

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What it is

The Temescal FC-1800 is an electron beam vacuum deposition system. The FC-1800 is one of the standard deposition systems from Temescal.[1][3][4]

How it works

The FC-1800 uses an electron beam power supply model CV-14 with 14 kW and an electron beam source model STIH-270 with six crucible pockets, three of 15 cc and three of 7 cc. The system has an 18-inch diameter water-cooled stainless steel chamber. A low-volume load lock mounted on top of the chamber uses a gate valve and motorized linear motion assembly for substrate exchange. A 7.5-inch diameter water-cooled rotating substrate stage with a speed range of 5 to 100 RPM can hold one 6-inch wafer or small pieces. A CTI-8 cryo pump and a mechanical pump achieve a base pressure better than 1x10^-7 torr. Deposition is controlled by an Inficon IC-5 deposition controller. An electron gun shutter assembly interfaces with the deposition controller.[5]

Where it fits in the process flow

The FC-1800 is used in research and development environments such as university nanofabrication facilities and solar cell research labs. The system accommodates substrates up to 156 mm for solar applications. The FC-1800 is configured for deposition of multiple films without breaking vacuum, using its six-pocket crucible system.[3][4][5]

Applications

General reference — not yet source-verified

Typical applications of e-beam evaporation include metallization for ohmic contacts and Schottky barriers, deposition of optically transparent conductive oxides, anti-reflective coatings, and thin-film resistors. The ability to deposit multiple layers without breaking vacuum makes such systems suitable for complex multilayer stacks.

What do the numbers mean?

Wafer handling2

TP-8-20 dome options
For the FC-1800 system, TP-8-20 domes are listed for 2-inch wafers (capacity 12), 3-inch wafers (capacity 17), and 100-mm wafers (capacity 13); dome diameter is 17.25 inches and spherical radius is 19.5 inches.[2]
Accurate?
HSP-20 planet options
For the FC-1800 system, HSP-20 planets are listed for 2-inch wafers (capacity 22), 3-inch wafers (capacity 12), 100-mm wafers (capacity 4 or high-capacity 6), 125-mm wafers (capacity 3 or high-capacity 4), and 150-mm wafers (capacity 2); planet diameter is 11.875 inches and spherical radius is 8.5 inches.[2]
Accurate?

Configuration & options5

System type
Deposition system[1]
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Spare parts kit
FC-1800 O-ring Spares Kit; replacements for all O-rings used on Temescal FC-1800 systems; part no. 0515-9270-0[1]
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Shields kit
FC-1800 Shields Kit; includes main section shield and dome shield; part no. 0615-7071-0[1]
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Tripod stand assembly
TP-8-20 Tripod Stand Assembly for Temescal FC-1800 system; used with TP-8-20 lift-off domes; part no. 0626-3934-0[2]
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Planetary fixture
HSP-20 Planetary Fixture for Temescal FC-1800 system; used with HSP-20 planets; part no. 0615-8084-0[2]
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Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What is the chamber diameter of the FC-1800?

The FC-1800 has an 18-inch diameter water-cooled stainless steel chamber.[5]

What is the base pressure of the FC-1800?

The FC-1800 can achieve a base pressure better than 1x10^-7 torr.[5]

How many crucible pockets does the FC-1800 electron beam source have?

The electron beam source model STIH-270 has six pockets, three of 15 cc and three of 7 cc.[5]

What wafer sizes can the HSP-20 planets accommodate?

HSP-20 planets for the FC-1800 can accommodate 2-inch, 3-inch, 100-mm, 125-mm, and 150-mm wafers with various capacities.[2]

Not publicly documented

The following facts about the FC-1800 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the FC-1800 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the FC-1800 are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the FC-1800 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the FC-1800 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the FC-1800 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (5)Every fact above is drawn from these public sources
  1. [1]web.archive.org — web.archive.orgweb.archive.org
  2. [2]web.archive.org — web.archive.orgweb.archive.org
  3. [3]40. Temescal FC-1800 - Core Research Facilities — cores.research.asu.educores.research.asu.edu
  4. [4]FC1800-1 Evaporator | Equipment | Facilities | Notre Dame Nanofabrication Facility | University of Notre Dame — nanofabrication.nd.edunanofabrication.nd.edu
  5. [5]Temescal FC-1800 Electron Beam Evaporator System | SemiStar — semistarcorp.comsemistarcorp.com
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Last updated Sep 30, 2026.

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