West Bond
2400 B
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The West Bond 2400 B is a wire bonder. The West Bond 2400 B belongs to the Packaging & Bonding equipment category.[1][2]
What it is
The West Bond 2400 B is a wire bonding machine.[1]
How it works
General reference — not yet source-verifiedWire bonders use either thermocompression, thermosonic, or ultrasonic bonding to attach the wire ends to the bond pads and package leads.
The wire is fed through a capillary or wedge tool and is bonded by applying force, heat, and ultrasonic energy.
Where it fits in the process flow
General reference — not yet source-verifiedWire bonding follows die attach and precedes encapsulation in the semiconductor assembly process.
The bonded package then undergoes molding or encapsulation to protect the wires.
Applications
General reference — not yet source-verifiedWire bonding is used for a wide range of package types including quad flat packages, ball grid arrays, and system-in-package modules.
Common bond wire materials include gold, aluminum, and copper.
What do the numbers mean?
Configuration & options1
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Not publicly documented
The following facts about the 2400 B are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
Fewer than 3 independently cited specifications for the 2400 B are on record; the remainder await public documentation.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 2400 B are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 2400 B are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 2400 B are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 2400 B are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]2400 B — West Bond | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
Last updated Oct 2, 2026.
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