West Bond
7400IW
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
General reference — not yet source-verifiedWire bonders make electrical interconnections between a device and its package or substrate by forming fine wire bonds at selected bond pads. Wire bonding machines are used in back-end semiconductor assembly rather than in wafer fabrication.
How it works
General reference — not yet source-verifiedWire bonding equipment positions a bond head over a device and a second bonding site, then forms a mechanical and electrical connection using a fine wire or wire-like interconnect. The bonding method can vary by tool class, including wedge bonding, ball bonding, thermosonic bonding, ultrasonic bonding, and thermocompression bonding.
Where it fits in the process flow
General reference — not yet source-verifiedA wire bonder sits in semiconductor assembly after die attach and before encapsulation or final package completion. The machine is used when a packaged device needs wire interconnects between the die and the package or lead structure.
Applications
General reference — not yet source-verifiedWire bonders are used for semiconductor device packaging, hybrid assembly, and laboratory or production bonding tasks that require fine interconnect formation. Such equipment is used on packages, substrates, and other assembly sites that accept bonded wire connections.
What do the numbers mean?
Configuration & options2
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
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Frequently asked questions
What is the West Bond 7400IW?
The West Bond 7400IW is a wire bonder used for semiconductor packaging and bonding work.[1]
Not publicly documented
The following facts about the 7400IW are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
Fewer than 3 independently cited specifications for the 7400IW are on record; the remainder await public documentation.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 7400IW are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 7400IW are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 7400IW are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 7400IW are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]semistarcorp.com — semistarcorp.comsemistarcorp.com
Last updated Oct 3, 2026.
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