West Bond
The West Bond 7600B is a manual wedge wire bonder, meaning the operator positions the bonding tool and initiates each bond by hand.
Wedge bonding uses ultrasonic energy combined with pressure to form a solid-state weld between the wire and the bond pad, without the use of a ball formation step.
In semiconductor packaging, wire bonding follows die attach and precedes encapsulation or molding.
The wire bonder receives packaged assemblies with the die mounted on a leadframe or substrate and connects the die bond pads to the package leads or lands.
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The West Bond 7600B uses a 90° vertical feed deep-access wedge bonding head.[1]
Models such as the West Bond 7400B and 7476B share a similar deep-access vertical feed configuration with the 7600B.[1]
The following facts about the 7600B are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 7600B are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 7600B are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 7600B are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 7600B are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 7600B is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 2, 2026.
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