West Bond
The West Bond 7700A is a manual wire bonder. The 7700A performs ultrasonic ball and wedge bonding. The machine is a thermosonic gold ball wire bonder. The 7700A uses hydrogen flame-off for ball formation.[1]
Wire bonders form electrical connections by feeding a fine wire through a capillary. A ball is created at the wire tip using an electric spark or hydrogen flame. The ball is then bonded to the bond pad with a combination of force, heat, and ultrasonic energy. The wire is then looped to the second bond point, where a wedge or stitch bond is made. The wire is then cut to complete the connection.
Wire bonders are used in the semiconductor packaging process after die attach and before encapsulation. The machine connects bond pads on the die to leads or pads on the substrate or leadframe.
Gold ball bonding is used for a wide range of semiconductor devices including integrated circuits, LEDs, and discrete components. Thermosonic bonding is suited for applications where a combination of heat and ultrasonic energy is required for reliable bonds.
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| West-Bond 7700A Hydrogen Flame Off Ultrasonic Ball-Wedge Bonder | — | — | Hydrogen flame off ultrasonic ball-wedge configuration. | semistarcorp.com[1] |
| West-Bond 7700A Manual Ball Bonder | — | — | Manual ball bonder configuration. | semistarcorp.com[1] |
| West-Bond 7700A Manual Thermosonic Gold Ball Wire Bonder | — | — | Manual thermosonic gold ball wire bonder configuration. | semistarcorp.com[1] |
| West-Bond 7700A Ultrasonic Gold Ball & Wedge Wire Bonder | — | — | Ultrasonic gold ball and wedge wire bonder configuration. | semistarcorp.com[1] |
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The following facts about the 7700A are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 7700A are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the 7700A are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 7700A are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 7700A is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 7700A are on record.
Answerable by: an OEM parts catalog or a service engineer
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Last updated Oct 3, 2026.
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