Waferpedia

West Bond

7700B

Packaging & BondingWest Bond 7700B family
Research Quality: 30% complete

Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

West Bond7700B
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  • Plate 01West Bond 7700B Bonder #61021

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  • Plate 02West Bond 7700B Bonder #61020

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What it is

The West Bond 7700B is a ball bonder used in semiconductor packaging and bonding.[1]

How it works

General reference — not yet source-verified

A ball bonder forms a free air ball at the end of a wire and then makes bonding connections with that wire.

Ball bonding is commonly used for interconnection work on packaged semiconductor devices, where the machine places a bond at the die pad and continues the wire path to a second bond location.

Where it fits in the process flow

General reference — not yet source-verified

The West Bond 7700B belongs in back-end assembly rather than front-end wafer fabrication.

Wire bonding follows die attach or related package assembly steps and precedes encapsulation or final package completion.

Applications

General reference — not yet source-verified

Ball bonding is used for electrical interconnects in semiconductor packages and similar microelectronic assemblies.

What do the numbers mean?

Control & software1

Described as
gold ball wire bonder w/ heated workholder & controller[1]
Accurate?

Configuration & options1

Type
ball bonder[1]
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Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Not publicly documented

The following facts about the 7700B are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • Fewer than 3 independently cited specifications for the 7700B are on record; the remainder await public documentation.

    Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 7700B are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the 7700B are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the 7700B are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the 7700B are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

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Sources & citations

Sources (1)Every fact above is drawn from these public sources
  1. [1]semistarcorp.com — semistarcorp.comsemistarcorp.com
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Last updated Oct 3, 2026.

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