West Bond
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Plate 01West Bond 7700B Bonder #61021
Plate 02West Bond 7700B Bonder #61020
The West Bond 7700B is a ball bonder used in semiconductor packaging and bonding.[1]
A ball bonder forms a free air ball at the end of a wire and then makes bonding connections with that wire.
Ball bonding is commonly used for interconnection work on packaged semiconductor devices, where the machine places a bond at the die pad and continues the wire path to a second bond location.
The West Bond 7700B belongs in back-end assembly rather than front-end wafer fabrication.
Wire bonding follows die attach or related package assembly steps and precedes encapsulation or final package completion.
Ball bonding is used for electrical interconnects in semiconductor packages and similar microelectronic assemblies.
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The following facts about the 7700B are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
Fewer than 3 independently cited specifications for the 7700B are on record; the remainder await public documentation.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 7700B are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 7700B are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 7700B are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 7700B are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
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Last updated Oct 3, 2026.
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