West Bond
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The West-Bond 7700C is a thermosonic ball-wedge wire bonder. The West-Bond 7700C is a manual wire bonder. The West-Bond 7700C uses a thermosonic bonding process.[1]
The West Bond 7700C is a thermosonic ball-wedge wire bonder.[1]
The bonder is equipped with a heated workholder that holds the substrate or package at a controlled temperature during bonding. The operator guides the bonding tool using a joystick and observes the process through a microscope with coaxial illumination.
Thermosonic ball-wedge bonding is commonly used for gold wire in standard IC packaging, such as plastic-encapsulated packages, and is also applied in optoelectronics, MEMS, and power device packaging where fine-pitch or deep-access bonding is required.
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The following facts about the 7700C are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
Fewer than 3 independently cited specifications for the 7700C are on record; the remainder await public documentation.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 7700C are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the 7700C are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 7700C are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 7700C is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 3, 2026.
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