YES
PB12-2P-CP
The YES PB12-2P-CP is a high-temperature vacuum bake/cure oven built for BCB/polyimide processes. The YES PB12-2P-CP accommodates 2 cassettes of 12-inch wafers in a single-compartment chamber. The YES PB12-2P-CP includes a CTC controller with a color touchscreen and a cooling package.[1][2]
Wafer size
12 in.
Power
208 V, 3 phase, 30 A, 50/60 Hz[3]
What it is
The YES PB12-2P-CP is a high-temperature vacuum bake/cure oven manufactured by Yield Engineering Systems (YES). The PB12-2P-CP is part of a series of ovens designed for processes such as polyimide bake, spin-on glass (SOG), flat panel processing, and benzocyclobutene (BCB) bake. The PB12-2P-CP is a single-compartment oven that accommodates two cassettes of 12-inch wafers. The PB12-2P-CP includes a CTC controller with a color touchscreen and a cooling package. The oven operates at temperatures up to 450 °C. The interior chamber dimensions are 14.5 inches by 21 inches by 27 inches deep.[1][4][2]
The PB12-2P-CP is specified with a nitrogen flow rate of 1 SCFM and Class One chamber cleanliness. Power requirements are 208 V, 3-phase, 30 A, 50/60 Hz. The PB12-2P-CP can also hold three cassettes of 200 mm wafers or ten cassettes of 150 mm wafers.[3]
How it works
The YES PB12-2P-CP oven uses a laminar flow of preheated nitrogen. Nitrogen is heated to the selected operating temperature and passes from the roof of the chamber down over the cassettes of wafers and out through the chamber base. Substrates in the preheated gas flow are cleaned of particles as the cycle proceeds. Particles are removed by exhaust during each evacuation cycle.[1]
The PB12-2P-CP is controlled by a CTC controller with a color touchscreen. The controller supports up to eight separate recipes, each with up to 16 ramps and dwells. The system includes a cooling package.[1][4]
Where it fits in the process flow
General reference — not yet source-verifiedThe YES PB12-2P-CP is used in semiconductor fabrication and advanced packaging as a curing oven for spin-on dielectrics. The oven typically follows spin-coating steps where polyimide, BCB, or SOG films are applied. The PB12-2P-CP cures these films at high temperature in a controlled nitrogen atmosphere to remove solvents and crosslink the material. After curing, wafers proceed to subsequent lithography or etch steps.
The PB12-2P-CP can also be used in flat panel display manufacturing for similar bake and cure processes. The oven operates as a batch tool, processing multiple cassettes per cycle.
Applications
The YES PB12-2P-CP is designed for high-temperature vacuum bake/cure of polyimide and BCB materials. The PB12-2P-CP is also used for spin-on glass (SOG) processing and flat panel applications.[1][4][2]
- polyimide bake
- BCB bake
- flat panel
What do the numbers mean?
Power & electrical1
Wafer handling1
Control & software2
Dimensions & facilities2
Configuration & options7
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| YES PB12-2P-CP | — | — | — | web.archive.org[1] |
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Electrical requirements208 V, 3 phase, 30 A, 50/60 Hz[3]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What is the maximum operating temperature of the PB12-2P-CP?
What wafer sizes and capacities does the PB12-2P-CP support?
The PB12-2P-CP holds two cassettes of 300 mm wafers, three cassettes of 200 mm wafers, or ten cassettes of 150 mm wafers.[1][3]
Not publicly documented
The following facts about the PB12-2P-CP are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the PB12-2P-CP are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the PB12-2P-CP are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the PB12-2P-CP are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the PB12-2P-CP is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the PB12-2P-CP are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (4)Every fact above is drawn from these public sources
- [1]web.archive.org — web.archive.orgweb.archive.org
- [2]YES PB12-2P-CP family | Waferpedia — waferpedia.comwaferpedia.com
- [3]semistarcorp.com — semistarcorp.comsemistarcorp.com
- [4]PB12-2P-CP — YES | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
Last updated Oct 5, 2026.
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