Waferpedia

Comparison ledger

PG 300 RM Grinder Lapperversus12 Lapper

Accretech PG 300 RM Grinder Lapper, Lapmaster 12 Lapper, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
12 LapperLapmaster
OEMAccretechLapmaster
CategoryCMPCMP
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAccretech PG 300 RM Grinder Lapper—
Specifications
ConfigurationHDD and Software included[1]—
Outside plate diameter—12 inches[2]
Lapping Speed Range—0 to 60 rpm[3]
Wafer Size Compatibility—4 inches or smaller[2]
Input Voltage—110 V[2]
Frequency—60 Hz[2]
Phase—1[2]
Number of Rings—3[2]
Number of Weights—3[2]
Includes Slurry System—Yes[2]
Includes Timer—Yes[2]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]jmind.comjmind.com
  3. [3]etd.ohiolink.eduetd.ohiolink.edu