Waferpedia

Comparison ledger

X Prep Milling Polishingversus12 Lapper

Allied High Tech X Prep Milling Polishing, Lapmaster 12 Lapper, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
X Prep Milling PolishingAllied High Tech
12 LapperLapmaster
OEMAllied High TechLapmaster
CategoryCMPCMP
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAllied High Tech X Prep Milling Polishing—
Cited variants—
Specifications
Axis configuration5-axis CNC-based[1]—
X/Y travelUp to 100 x 100 mm[1]—
Z-axis resolution0.1 micron[1]—
Z-axis accuracy1 micron[1]—
X/Y-axis resolution1 micron[1]—
Z-force control range0.5 to 10 N[1]—
Tool colletUniversal tool collet uses 3 mm x 1.5" (38 mm) length tools (0.25 mm - 12 mm grinding/polishing tip)[1]—
CameraLive HD (720p) color camera[1]—
Display12" color LCD touch-screen[1]—
Weight210 lb. (95 kg)[1]—
Shipping weight310 lb. (141 kg)[1]—
Dimensions21" W x 27" D x 25" H (533 x 686 x 622 mm)[1]—
Voltage options100-125 V AC 50/60 Hz 1 Phase (model 15-9650); 208-240 V AC 50/60 Hz 1 Phase (model 15-9650-230)[1]—
WarrantyTwo (2) year warranty[1]—
CE complianceCE compliant for EU[1]—
Wafer size12 inch[2]—
Outside plate diameter—12 inches[3]
Lapping Speed Range—0 to 60 rpm[4]
Wafer Size Compatibility—4 inches or smaller[3]
Input Voltage—110 V[3]
Frequency—60 Hz[3]
Phase—1[3]
Number of Rings—3[3]
Number of Weights—3[3]
Includes Slurry System—Yes[3]
Includes Timer—Yes[3]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]alliedhightech.comalliedhightech.com
  2. [2]Equipment inventory listing
  3. [3]jmind.comjmind.com
  4. [4]etd.ohiolink.eduetd.ohiolink.edu