Waferpedia

Comparison ledger

0010-22161 High EFF RF MatchversusAS 8 Alta Spray

Applied Materials 0010-22161 High EFF RF Match, SUSS MicroTec AS 8 Alta Spray, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
AS 8 Alta SpraySUSS MicroTec
OEMApplied MaterialsSUSS MicroTec
Category——
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-22161 High EFF RF MatchSUSS MicroTec AS 8
Specifications
MakeApplied Materials[1]—
Model0010-22161[1]—
DescriptionHTESC PH 1 REV A[2]—
ConditionUsed[2]—
Stock NumberBM6628[2]—
Configuration—With:[3]
Tool type—Manual spray coater for high topographies[4]
Substrate size—Up to 200 mm and square substrates up to 6 inch edge length[4]
Wafer sizes—3, 4, 5, 6, 8 inch[3]
Spray coater description—Spray coater for 3-inch to 8-inch wafers[5]
Maximum substrate size—8 inch[6]
Resist spray dispense system—High precision resist spray dispense system up to 30 CPS, Resist type[3]
Pre-wet dispense nozzle—Altaspray, bowl clean solvent type[3]
Pressure tank system—10 L SS with coupling[3]
Substrate assembly—R6 Altaspray BSR ready[3]
Resist storage—Stainless steel (x2)[3]
Media storage—SS EX[3]
Waste canister—10 L stainless steel[3]
Transformer—For manual tool[3]
Vintage—2018[3]
Spray axis velocity—Up to 500 mm/s[4]
Acceleration—Up to 9 m/s²[4]
Z-axis adjustment range—Up to 45 mm[4]
Nozzle adjustment range—67.5 mm to 107.5 mm[4]
Chuck rotation—Up to 1,000 rpm[4]
Nozzles—Dual spray nozzles and separate solvent nozzle[4]
Filter unit—Solvent[3]
Maximum rotation speed—Up to 1,000 rpm[4]
Manual—2018[3]
Sources (6)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]tarasemi.comtarasemi.com
  3. [3]inventory listing
  4. [4]suss.comsuss.com
  5. [5]waferpedia.comwaferpedia.com
  6. [6]nnci.netnnci.net