Comparison ledger
Applied Materials 0041-26723 Bonded Assembly, Finetech Fineplacer Lambda, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0041-26723 Bonded AssemblyApplied Materials | Fineplacer LambdaFinetech |
|---|---|---|
| OEM | Applied Materials | Finetech |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0041-26723 Bonded Assembly | Finetech Fineplacer Lambda |
| Specifications | ||
| Configuration | — | HDD and Software[1] |
| Placement accuracy | — | sub-micron[2] |
| Bonding force | — | 500 N[1] |
| Bonding technologies | — | Thermocompression, ultrasonic/thermosonic, ACF bonding, UV cure, C4 chip bonding[3] |
| Vision alignment system | — | Dual-image overlay with stationary beam splitter[3] |
| Substrate size (max) | — | 50 mm square[4] |
| Die size (min) | — | 2–3 mm[4] |
| Substrate thickness range | — | 0 to 10 mm[3] |
| Heated stage option | — | available[4] |
| Heated placement tool option | — | available[4] |
| Bonding technology | — | die bonding (as die bonder)[1] |
| Force option | — | 500N Force[1] |
| Vision system | — | patented advanced Vision Alignment System[3] |
| Alignment principle | — | imaging two orthogonal images simultaneously into one common image plane[3] |
| System type | — | sub-micron bonding system[3] |
| Module interface | — | Finetech Module Interface (FMI)[3] |
| Mains voltage | — | Mains voltage out, max 10A load (fuse)[3] |
| Accessory optics | — | special optics for positioning large fine pitch devices, high magnification systems[3] |
| Maximum bonding force | — | 500 N[1] |
| Interface | — | RS-232[3] |
| Vacuum | — | Built-in vacuum pump[3] |
| Adjustment set resolution | — | 1 µm[3] |
| Maximum force | — | 500N[1] |
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