Finetech
Fineplacer Lambda
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Finetech Fineplacer Lambda is a die bonder that provides sub-micron placement accuracy. The Fineplacer Lambda supports thermocompression and ultrasonic bonding technologies. The Fineplacer Lambda can deliver up to 500 N of bonding force.[1][2]
Power
Mains voltage out, max 10A load (fuse)[3]
Vacuum
Built-in vacuum pump[3]
Performance
sub-micron[1]
Optics
1 µm[3]
What it is
How it works
Where it fits in the process flow
General reference — not yet source-verifiedDie bonders like the Fineplacer Lambda are used in the packaging stage of semiconductor and micro-device fabrication. The machine places individual dice onto a substrate or package after wafer dicing and before subsequent steps such as wire bonding, encapsulation, or testing.
What do the numbers mean?
Power & electrical1
Vacuum & pumping1
Wafer handling2
Optics & imaging2
- Accessory optics
- special optics for positioning large fine pitch devices, high magnification systems[3]
Performance5
Control & software3
- HDD and Software[2]
Configuration & options15
- 500N Force[2]
- Added higher load cell table[2]
- Bonding technologies
- Thermocompression, ultrasonic/thermosonic, ACF bonding, UV cure, C4 chip bonding[3]
- Bonding technologies
- thermocompression, ultrasonic/thermosonic bonding, ACF bonding, UV cure, bonding of C4 chips[3]
- Bonding technologies
- Thermocompression, ultrasonic/thermosonic, ACF, UV cure, C4 chip bonding[3]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What placement accuracy does the Fineplacer Lambda provide?
The Fineplacer Lambda provides sub-micron placement accuracy.[1][4]
What bonding methods are supported?
The system supports thermocompression bonding, ultrasonic/thermosonic bonding, ACF bonding, UV cure, and bonding of C4 chips.[3]
What are the maximum substrate and minimum die sizes handled by standard tooling?
Standard tooling can handle dies as small as 2–3 mm and substrates up to 50 mm square.[4]
What is the maximum bonding force available?
The system can be configured with a bonding force of 500 N.[2]
Not publicly documented
The following facts about the Fineplacer Lambda are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Fineplacer Lambda are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Fineplacer Lambda are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Fineplacer Lambda are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Fineplacer Lambda are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Fineplacer Lambda is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (6)Every fact above is drawn from these public sources
- [1]epfl.ch — epfl.chepfl.ch
- [2]Inventory photo
- [3]manualslib.com — manualslib.commanualslib.com
- [4]research.rice.edu — research.rice.eduresearch.rice.edu
- [5]Наноиндустрия - научно-технический журнал - Наноиндустрия - Субмикронные системы монтажа FINEPLACER для высокоточной сборки — doi.orgdoi.org
- [6]Equipment inventory listing
Last updated Oct 11, 2026.
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