Comparison ledger
ASML 5500/80, CEE 100, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 5500/80ASML | 100CEE |
|---|---|---|
| OEM | ASML | CEE |
| Category | Lithography | Lithography |
| Wafer size | 4-inch wafers; convertible to 3-inch or 6-inch platforms | 6" |
| Process node | 500nm resolution | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | i-Line | — |
| Family | ASML 5500/80 | CEE 100 |
| Cited variants | — |
|
| Specifications | ||
| Resolution | 500nm[2] | — |
| Alignment accuracy | <70nm[2] | — |
| Wafer setup | Set up for 4-inch wafers[2] | — |
| Convertible platforms | 3-inch or 6-inch platforms[2] | — |
| Field size | 21mm x 21mm[2] | — |
| Depth of focus | 1.3µm[2] | — |
| Category | Lithography[3] | — |
| Wafer size | 4-inch wafers; convertible to 3-inch or 6-inch platforms[2] | Up to 6 inches[5] |
| Generation | i-line[4] | — |
| Tool type | — | Spray Developer[1] |
| Accepts wafer size | — | up to 6" wafers[5] |
| Programmable programs | — | 10 programs[5] |
| Steps per program | — | up to 10 steps[5] |
| Programmable step parameters | — | Acceleration, Speed, Time[5] |
| Associated document | — | CEE Model 100CB Spinner.doc[5] |
| Programs | — | 10 programs each with up to 10 steps[5] |
| Control parameters | — | Acceleration, Speed, Time[5] |
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