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Comparison ledger

18 D SurfaceversusDFL 7160 Laser Dicing

Blanchard 18 D Surface, Disco DFL 7160 Laser Dicing, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
18 D SurfaceBlanchard
OEMBlanchardDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlanchard 18 D SurfaceDisco DFL 7160
Specifications
Voltage416 V[1]—
Phase3 Phase[1]—
Cycles50[1]—
Control Voltage110[1]—
MakeBlanchard[1]—
Model18 D[1]—
Asset #153970[1]—
Power416 V, 3 phase[1]—
Configuration—Non-operational[3]
Equipment type—Fully automatic laser saw[4]
Max. workpiece size—Φ300 mm[4]
Processing method—Ablation[4]
Laser wavelength—355 nm[5]
Laser maximum power—18 W[5]
X-axis processing range—310 mm[4]
Y-axis processing range—310 mm[4]
X-axis moving speed—0.1–600 mm/s[4]
X-axis index step—0.0001 mm[4]
Positioning accuracy—0.003/310 mm (single error), 0.002/5 mm[4]
Z-axis moving resolution—0.00005 mm[4]
Repeatability accuracy—0.002 mm[4]
θ-axis max. rotating angle—380 deg[4]
Equipment dimensions—1,200 × 1,550 × 1,800 mm[4]
Equipment weight—Approx. 1,750 kg[4]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]Equipment inventory listing
  3. [3]inventory listing
  4. [4]disco.co.jpdisco.co.jp
  5. [5]semistarcorp.comsemistarcorp.com