Disco
DFL 7160 Laser Dicing
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Disco DFL 7160 Laser Dicing is a fully automatic laser saw for Φ300 mm wafers. The Disco DFL 7160 Laser Dicing uses a pulse laser to achieve non-thermal processing. The Disco DFL 7160 Laser Dicing supports full cut and DAF cut applications.[1][2]
What it is
The Disco DFL 7160 is a fully automatic laser saw for wafer dicing.[1]
How it works
Where it fits in the process flow
Applications
The DFL 7160 supports GaAs full cut and DAF cut after DBG.[1][2]
The DFL 7160 supports removal of TEG on low-k grooves or streets and full cut for Si and compound semiconductors.[1][2]
The DFL 7160 includes a kerf check function that automatically checks and adjusts the laser cut position.[1][2]
The DFL 7160 can use a HogoMax coating and cleaning mechanism to help prevent wafer contamination from laser processing particles.[1][2]
Why won't it start?
Documented failure modes, common issues, and field considerations.
- Non-operational
What do the numbers mean?
Optics & imaging4
Performance2
Dimensions & facilities2
Configuration & options8
- Non-operational[3]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the DFL 7160 Laser Dicing are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DFL 7160 Laser Dicing are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DFL 7160 Laser Dicing are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DFL 7160 Laser Dicing are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the DFL 7160 Laser Dicing is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the DFL 7160 Laser Dicing are on record.
Answerable by: an OEM parts catalog or a service engineer
Sources & citations
Sources (4)Every fact above is drawn from these public sources
- [1]disco.co.jp — disco.co.jpdisco.co.jp
- [2]DFL7160 | AUROTECH CORPORATION — aurotech.comaurotech.com
- [3]inventory listing
- [4]semistarcorp.comsemistarcorp.com
Last updated Oct 10, 2026.
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