Waferpedia

Comparison ledger

B2versus808

Brewer Science B2, OAI 808, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
B2Brewer Science
808OAI
OEMBrewer ScienceOAI
CategoryLithographyLithography
Wafer size100mm100mm
Process nodeDUV—
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBrewer Science B2OAI 808
Specifications
TypeDevelopable BARC[1]semi-automated, four-camera, optical front- and backside mask aligner[2]
Name in ACT-8 process listB2 DUV42P[1]—
Configured wafer size on ACT-8100 mm (4") wafers[1]—
Motorized features—motorized backside focus, motorized auto leveling, auto gap setting[2]
Size—2", 100mm, 150mm, 200mm pieces[2]
Mask size—4"x4"; 5"x5", 7"x7", and 9"x9"[2]
Top side alignment accuracy—± 1.0µm 3σ[2]
Bottom side alignment accuracy—± 1.25µm 3σ[2]
Large gap alignment accuracy—Option / ± 1.5µm 3σ[2]
Resolution—Vacuum + Hard Contact ≤ 1 µm; Hard Contact ≤ 1.5 µm; Soft Contact ≤ 2.0 µm; Proximity ≥ 3.0 µm[2]
Exposure wavelength—350 · ´50 nm[2]
Mercury arc lamp—350 W[2]
Model—OAI 808 Aligner[2]
Description—Semi-automated, four-camera, optical front- and backside mask aligner[3]
Alignment accuracy—Top side alignment: ± 1.0µm 3σ; bottom side alignment: ± 1.25µm 3σ; large gap alignment: option / ± 1.5µm 3σ[2]
Lamp—Mercury arc lamp, 350 W[2]
Supported substrate sizes—5 mm to 200 mm[2]
Thickness—0.1–10 mm[2]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]epfl.chepfl.ch
  2. [2]cores.research.asu.educores.research.asu.edu
  3. [3]cores.research.asu.educores.research.asu.edu