OAI
808
What it is
How it works
The OAI 808 supports front-side and backside alignment and uses motorized backside focus, motorized auto leveling, and auto gap setting.[1]
Where it fits in the process flow
General reference — not yet source-verifiedMask alignment and exposure occur in the lithography section of a microfabrication flow after resist coating and before pattern development and later transfer steps.
Applications
The OAI 808 is used for high-resolution contact mask alignment and exposure in lithography.[1][3]
The OAI 808 can process glass and ceramic substrates and supports substrate sizes from 5 mm to 200 mm.[3]
- Lithography
- Optical front-side and backside mask alignment
What do the numbers mean?
Vacuum & pumping1
- Resolution
- Vacuum + Hard Contact ≤ 1 µm; Hard Contact ≤ 1.5 µm; Soft Contact ≤ 2.0 µm; Proximity ≥ 3.0 µm[1]
Wafer handling1
Optics & imaging6
Performance4
- Alignment accuracy
- Top side alignment: ± 1.0µm 3σ; bottom side alignment: ± 1.25µm 3σ; large gap alignment: option / ± 1.5µm 3σ[1]
Configuration & options6
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- ResolutionVacuum + Hard Contact ≤ 1 µm; Hard Contact ≤ 1.5 µm; Soft Contact ≤ 2.0 µm; Proximity ≥ 3.0 µm[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What alignment modes does the OAI 808 support?
The OAI 808 supports front-side and backside mask alignment.[1]
What alignment accuracy is specified for the OAI 808?
The OAI 808 is specified for top-side alignment of ± 1.0 µm 3σ, bottom-side alignment of ± 1.25 µm 3σ, and large-gap alignment of ± 1.5 µm 3σ as an option.[1]
Not publicly documented
The following facts about the 808 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 808 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 808 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 808 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 808 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 808 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]cores.research.asu.edu — cores.research.asu.educores.research.asu.edu
- [2]cores.research.asu.edu — cores.research.asu.educores.research.asu.edu
- [3]https://cores.research.asu.edu/wp-content/uploads/2026/06/OAI-808-Aligner-Tool-Procedures-Rev-C_4-23-13.pdf — cores.research.asu.educores.research.asu.edu
Last updated Oct 3, 2026.
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