Waferpedia

Comparison ledger

321versusDW 288 S 4 Diamond

Disco 321, Meyer Burger DW 288 S 4 Diamond, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
321Disco
DW 288 S 4 DiamondMeyer Burger
OEMDiscoMeyer Burger
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco 321Meyer Burger DW 288
Specifications
OEMDisco[1]—
Model321[1]DW 288 S 4[4]
Equipment typeWafer Dicing Saw[1]—
Facility contextCleanroom Instrumentation[1]—
Application areaNano and Micro Fabrication[1]—
LocationFNT 4.106[1]—
Wafer SizeUp to 6 inches[2]—
Spindle Power1.0 kW Synchro Spindle (or 1.5 kW Synchro Spindle in some configurations)[3]—
Spindle Power (alternate)1500 Watt spindle[2]—
Non-Contact SetupNon Contact Setup[3]—
MicroscopeMicroscope With Eyepiece and Shutter (or Dual Objective Microscope With Eyepiece)[3]—
Broken Blade DetectionBroken Blade Detection[3]—
Light TowerIncludes Light Tower[3]—
Chuck Type6" Universal Chuck (or 6" Porous Film Frame Chuck)[2]—
Wafer size capabilityUp to 6" wafers[3]—
Chuck6-inch porous film frame chuck[2]—
Spindle power1500-watt spindle[2]—
FootprintSmall footprint[2]—
SetupNon-contact setup[3]—
Blade break detectionBroken blade detection[3]—
Other featuresFloppy drive, light tower, blade tools, manuals[3]—
Configuration—Wire Management System WM2[4]
Operating hours of Mc—18,534 hours[4]
Operating hours of automatic Mc—453 hours[4]
Operating hours of main drive—534 hours[4]
13112403/2—Way Solenoid Valve DN4 reference 10040439 (1)[4]
1310366—Cutting Fluid additive ADDITIVEA33 ref BLASER 29106020001 (1)[4]
1310362—Beam DMT710 420x50x16mm 100mm radius ref 10266500 (95)[4]
1310361—Beam DMT710 420x50x16mm 75mm radius ref 10266493 (175)[4]
1310363—Beam DMT710 carre 156 420x156x16mm ref 10266501 (95)[4]
1310364—Fil diamante 12 PLAU, 60KM, MB50 ref 12PLAU0F31560A (6)[4]
Manufacturer—Meyer Burger[4]
Category—Dicing & Grinding[5]
Machine type—Multi Wire Saw[6]
Application—Smart slicing technology for sapphire, and other hard and brittle materials[6]
Process—Slicing semiconductor silicon and sapphire into wafer[6]
Work piece dimensions—Max. Ø 8″ × 420 mm or ≤ 210 × 420 mm[7]
Web length—420 mm[7]
Wire speed—25 m/s (1500 m/min)[7]
Wire acceleration—8 m/s² (< 4 s)[7]
Min. wire diameter—100 μm[7]
Max. wire tension—45 N[7]
Rocking principle—Rocking of work piece[7]
Rocking angle—± 12°[7]
Wire guide roller axis distance—540 mm[7]
Cutting fluid tank—240 l[7]
Machine dimensions—3620 × 1780 × 3010 mm[7]
Machine weight—10500 kg[7]
Power & electrical—Standard Europe power management (400V, 230V Schuko plugs)[5]
US electrical conversion—UL conversion and voltage conversion (480V, 110V plugs)[5]
Wire management system—WM2[4]
Cutting fluid media module—Saphir cutting fluid media module with long filter[4]
Cutting fluid manifold—Without regulation valves, 1 mechanical flow meter, and flow bars[4]
Tank drain—With hand valve[4]
1310135—Sock Filter P01 micron 25L ref 10040184 (50)[4]
1310365—Cutting Fluid SYNERGY DWS300 ref Blaser 17300010025 (6)[4]
1311236—Force transducer 100N Diam=36 reference 10240940 (1)[4]
1311243—Insert sleeve E 15/12x reference 79260 (2)[4]
1311237—Level sensor LFP0400-A4NMB L 360 reference 10116033 (1)[4]
1311234—O ring NBR70 222x5 reference 10015299 (2)[4]
1311232—O ring NBR75 240x3 reference 10037880 (2)[4]
1310136—Pulley Diameter 156,6 reference 10101530 (42)[4]
1311231—Precision ball reference 10075759 (4)[4]
1316934—Resistance bac ultrason Ref 10167_88 (5)[4]
1311238—Temperature sensor D4x57 reference 10075173 (2)[4]

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Sources (7)Every fact above is drawn from these public sources
  1. [1]tmi.utexas.edutmi.utexas.edu
  2. [2]jmind.comjmind.com
  3. [3]gtsaz.comgtsaz.com
  4. [4]inventory listing
  5. [5]waferpedia.comwaferpedia.com
  6. [6]lapmaster-wolters.comlapmaster-wolters.com
  7. [7]precision-surface.comprecision-surface.com