Meyer Burger

The saw employs only six pulleys for optimal diamond wire usage and supports wire speeds up to 25 m/s (1500 m/min) with a wire acceleration of 8 m/s² (achieving full speed in under 4 seconds). The minimum wire diameter is 100 μm and maximum wire tension is 45 N.[4]
Options include an adaptive feed system for optimizing the cutting process and a Diamond Wire Management System (DWMS) for monitoring and controlling wire consumption. The machine also features a cutting fluid tank of 240 liters capacity and uses a wire management system (WM2) on the DW 288 S 4 Diamond variant.[1][3]
The machine can handle both semiconductor-grade silicon and sapphire ingots, and its process know-how can be transferred to other hard and brittle materials such as ceramics, quartz, or silicon carbide.[3]
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The following facts about the DW 288 S 4 Diamond are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DW 288 S 4 Diamond are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DW 288 S 4 Diamond are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DW 288 S 4 Diamond are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DW 288 S 4 Diamond are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DW 288 S 4 Diamond is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 11, 2026.
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