Waferpedia

Comparison ledger

DFG 8560versusDS 266

Disco DFG 8560, Meyer Burger DS 266, side by side. Every value shown is drawn from the cited encyclopedia entries.

Documented as functional equivalents— Same function class: Dicing & Grinding, null[1]
Side-by-side comparison of selected equipment models
Attribute
DS 266Meyer Burger
OEMDiscoMeyer Burger
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco DFGMeyer Burger DS 266
Specifications
Phase3 Phase[2]—
Voltage200V[2]400V[1]
Configuration3 Wire + 2 Ground[2]120A[1]
Spindle TypeAir Bearings[2]—
External CoolingWater Cooled[2]—
Frequency50 / 60 Hz[3]50 Hz[1]
Full Load Amps57 A[3]—
Maximum workpiece size300 mm[4]—
Number of spindles2[4]—
Spindle power (Z1-Z3)4.8 kW[4]—
Spindle speed (Z1-Z3)1,000 - 4,000 min⁻¹[4]—
Number of work tables3[4]—
Dimensions (WxDxH)1,400 x 3,322 x 1,800 mm[4]—
Weightapprox. 4,000 kg[4]—
Full load amperage57 A[2]—
Machine typeGrinder[2]—
Wiring3 Wire + 2 Ground[2]—
ChillerDisco DTU 152[2]—
OEMDisco[2]—
ModelDFG 8560[2]—
CategoryDicing & Grinding[4]—
AutomationFully automatic[4]—
Spindle count2[4]—
Work table count3[4]—
Power200 VAC, 3 phase, 50/60 Hz, 57 A[3]—
Vintage2011[2]2008[1]
Current—120 A[1]
Wafer Size—8 inch[5]
Includes HDD & Software—Yes[5]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]inventory listing
  4. [4]web.archive.orgweb.archive.org
  5. [5]inventory listing