Waferpedia

Comparison ledger

OnTrak Synergy Postversus15 Lapper

Lam Research OnTrak Synergy Post, Lapmaster 15 Lapper, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
15 LapperLapmaster
OEMLam ResearchLapmaster
CategoryCMPCMP
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyLam Research OnTrak Synergy PostLapmaster 15
Specifications
ConfigurationWith Hepa Mini-Environment[1]Equipped with:[3]
Tool TypePost-CMP cleaner[2]—
Wafer Size8 inch (200 mm)[1]—
Number Of Conditioning Rings—Up to 3[3]
Ring ID—Up to 5.5″[3]
Plate Diameter – Outside—15″[3]
Plate Diameter – Inside—3 1/2″[3]
Standard RPM—60[3]
Drive Motor—1/2 HP[3]
Electrics—110V / 1Ph / 60Hz[3]
Dimensions – Approximate—26″(L-R) x 21″(F-B) x 22″(H)[3]
Equipped with: 15″ Cast Iron Plate—Included[3]
Equipped with: (3) Yoke/Roller Bearing Assemblies—Included[3]
Equipped with: (3) Conditioning Rings—Included[3]
Equipped with: (3) Hold Downs—Included[3]
Equipped with: 30 Minute Timer—Included[3]

Plan your fab

Building a CMP process? Get a complete equipment list.

Open the fab equipment planner →
Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]fabsurplus.comfabsurplus.com
  3. [3]inventory listing