Comparison ledger
Nitto HR 8500 III TW UV Detaper, Semitool 11600 SRD, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 11600 SRDSemitool | |
|---|---|---|
| OEM | Nitto | Semitool |
| Category | Wet Processing / Clean | Wet Processing / Clean |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Nitto HR 8500 III TW UV Detaper | Semitool 11600 SRD |
| Specifications | ||
| Control Method | One Board Micro Computer[1] | — |
| Wafer Transfer Robot | 3-axis type[1] | — |
| Configuration | Installation Environment:[1] | Ceramic[2] |
| Temperature | 25 ± 5 degrees C[1] | — |
| Humidity | 45 ± 15%[1] | — |
| Others | Clean level ; Class 1,000 or more (Place where it will be subjected to direct sunlight)[1] | — |
| Power | 1.5 kVA[1] | — |
| For Air | Rc 3/8 screw[1] | — |
| Lug with grounding linw (Cable Length | Approx. 5m)[1] | — |
| OEM | Nitto Denko[1] | — |
| Model | HR 8500 III TW UV[1] | 11600 SRD[2] |
| Wafer Sizes | 8 inch[1] | — |
| Clean level | Class 1,000 or more[1] | — |
| Power Supply | Single Phase; AC 100 V ± 5%; 1.5 kVA; 50/60 Hz[1] | — |
| Air Supply | Dry Air; 0.5 MPa or more; 250 NL/min or more[1] | — |
| Connection Port | For electrical power; For Air: Rc 3/8 screw; Lug with grounding linw (Cable Length: Approx. 5m)[1] | — |
| Manufacturer | — | Semitool[2] |
| Equipment type | — | Spin Rinse Dryer[2] |
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