Nitto
Nitto Denko HR 8500 III TW UV Detaper is an 8-inch wafer tool. Nitto Denko HR 8500 III TW UV Detaper uses a one-board micro computer control method. Nitto Denko HR 8500 III TW UV Detaper includes a 3-axis type wafer transfer robot.[1]

A UV detaper is a machine that removes UV-curable tape from semiconductor wafers after processing steps such as backgrinding or dicing. The tape holds the wafer during processing and is released by exposing it to ultraviolet light, which reduces the adhesive strength and allows mechanical peeling.
UV detapers operate by first exposing the taped wafer to ultraviolet light, which breaks down the adhesive bond between the tape and the wafer surface. After UV exposure, a mechanical peeling mechanism separates the tape from the wafer without applying excessive force to the fragile substrate.
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The following facts about the HR 8500 III TW UV Detaper are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the HR 8500 III TW UV Detaper are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the HR 8500 III TW UV Detaper are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the HR 8500 III TW UV Detaper are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the HR 8500 III TW UV Detaper are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the HR 8500 III TW UV Detaper is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 5, 2026.
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