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Multiplex ICP ASE Advanced Silicon Etch (ASE)versus1512e

STS Multiplex ICP ASE Advanced Silicon Etch (ASE), Tegal 1512e, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
1512eTegal
OEMSTSTegal
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilySTS Multiplex ICPTegal 1512e
Cited variants
  • STS Multiplex ICP ASE Advanced Silicon Etch (ASE) system, 6" - Manual load lock[1]
  • STS Multiplex ICP ASE Advanced Silicon Etch (ASE) system, 6" - Manual load lock – Carousel Loader[2]
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Specifications
ConfigurationCurrently configured for 150 mm wafers[1]—
Voltage208V, 60Hz, 50A 3 phase[1]—
MakeSTS[1]—
ModelMultiplex ICP ASE[1]—
Wafer Sizes6 inch[1]—
Configured wafer size150 mm wafers[1]—
Load lockManual load lock[1]—
Wafer handlingManual load lock – Carousel Loader[3]—
Backside coolingHe Backside Cooling 150mm clamp configuration[1]—
RF power supplyENI 300/30 Watt 13.56MHz RF power supply[1]—
Upper electrode RF power supplyENI ACG-10B 1KW 13.56MHz RF Upper Electrode power supply[1]—
Turbo pumpLeybold Mag 2000CT Turbo pump with Leybold Mag Drive Controller[1]—
Gas panelOnBoard gas panel – 4 MFCs[1]—
Electrical208V, 60Hz, 50A 3 phase[1]—
CategoryEtch[3]—
Process architectureInductively coupled plasma etch architecture[3]—
OptionMAC Cassette to Cassette Loader can be an option[1]—
Tool type—Industrial RIE plasma etcher system[4]
Stated configuration—With modules assembly for CI-4222[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]Equipment inventory listing
  3. [3]waferpedia.comwaferpedia.com
  4. [4]semistarcorp.comsemistarcorp.com