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STS

Multiplex ICP ASE Advanced Silicon Etch (ASE)

EtchSTS Multiplex ICP family
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Multiplex ICP ASE Advanced Silicon Etch (ASE) — Inventory photo
Fig. 01Multiplex ICP ASE Advanced Silicon Etch (ASE)Inventory photo[1]

Power

ENI 300/30 Watt 13.56MHz RF power supply[1]

Gas delivery

OnBoard gas panel – 4 MFCs[1]

What it is

The STS Multiplex ICP ASE Advanced Silicon Etch is a semiconductor etch system from STS. The equipment is in the etch class and is used as an advanced silicon etch tool.[1][3]

How it works

The STS Multiplex ICP ASE Advanced Silicon Etch uses inductively coupled plasma etch architecture. The tool uses RF power, gas delivery, and vacuum pumping to sustain a plasma and direct the etch process at the wafer surface.[1][3]

Applications

General reference — not yet source-verified

The equipment class is suited to patterned semiconductor features that need anisotropic plasma etching. The class is also used where process control depends on gas composition, RF power, and wafer temperature management.

What do the numbers mean?

Power & electrical8

ENI 300/30 Watt 13.56MHz RF power supply[1]
Accurate?
With an ENI ACG-10B 1KW 13.56MHz RF Upper Electrode power supply[1]
Accurate?
Voltage
208V, 60Hz, 50A 3 phase[1]
Accurate?
ENI ACG-3 300/30 Watt 13.56MHz RF power supply[2]
Accurate?
RF power supply
ENI 300/30 Watt 13.56MHz RF power supply[1]
Accurate?
Upper electrode RF power supply
ENI ACG-10B 1KW 13.56MHz RF Upper Electrode power supply[1]
Accurate?
Electrical
208V, 60Hz, 50A 3 phase[1]
Accurate?
RF power supply
ENI ACG-3 300/30 Watt 13.56MHz RF power supply[2]
Accurate?

Vacuum & pumping4

Leybold Mag 2000CT Turbo pump with Leybold Mag Drive Controller[1]
Accurate?
Pfeiffer TMH 1000PC Turbo pump with Pfeiffer Turbo Controller[2]
Accurate?
Turbo pump
Leybold Mag 2000CT Turbo pump with Leybold Mag Drive Controller[1]
Accurate?
Turbo pump
Pfeiffer TMH 1000PC Turbo pump with Pfeiffer Turbo Controller[2]
Accurate?

Wafer handling10

Currently configured for 150 mm wafers[1]
Accurate?
Manual load lock[1]
Accurate?
MAC Cassette to Cassette Loader can be an option[1]
Accurate?
Manual load lock – Carousel Loader[2]
Accurate?
Wafer Sizes
6 inch[1]
Accurate?
Configured wafer size
150 mm wafers[1]
Accurate?
Load lock
Manual load lock[1]
Accurate?
Wafer handling
Manual load lock – Carousel Loader[3]
Accurate?
Wafer handling
Manual load lock[3]
Accurate?
MAC Cassette to Cassette Loader can be an option[1]
Accurate?

Gas & chemistry4

OnBoard gas panel – 4 MFCs[1]
Accurate?
Remote gas panel – 4 MFCs[2]
Accurate?
Gas panel
OnBoard gas panel – 4 MFCs[1]
Accurate?
Gas panel
Remote gas panel – 4 MFCs[2]
Accurate?

Configuration & options6

He Backside Cooling 150mm clamp configuration[1]
Accurate?
Make
STS[1]
Accurate?
Model
Multiplex ICP ASE[1]
Accurate?
Backside cooling
He Backside Cooling 150mm clamp configuration[1]
Accurate?
Category
Etch[3]
Accurate?
Process architecture
Inductively coupled plasma etch architecture[3]
Accurate?

Vintage & configurations

Documented models & variants

DesignationGenerationVintageChangesSource
STS Multiplex ICP ASE Advanced Silicon Etch (ASE) system, 6" - Manual load lock——Manual load lock; He Backside Cooling 150mm clamp configuration; ENI 300/30 Watt 13.56MHz RF power supply; Leybold Mag 2000CT Turbo pump with Leybold Mag Drive Controller; OnBoard gas panel.Equipment inventory listing[1]
STS Multiplex ICP ASE Advanced Silicon Etch (ASE) system, 6" - Manual load lock – Carousel Loader——Manual load lock; Carousel Loader; He Backside Cooling 150mm clamp configuration; ENI ACG-3 300/30 Watt 13.56MHz RF power supply; Pfeiffer TMH 1000PC Turbo pump with Pfeiffer Turbo Controller; Remote gas panel.Equipment inventory listing[2]
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • ConfigurationENI 300/30 Watt 13.56MHz RF power supply[1]
  • ConfigurationWith an ENI ACG-10B 1KW 13.56MHz RF Upper Electrode power supply[1]
  • ConfigurationLeybold Mag 2000CT Turbo pump with Leybold Mag Drive Controller[1]
  • ConfigurationOnBoard gas panel – 4 MFCs[1]
  • Voltage208V, 60Hz, 50A 3 phase[1]
  • ConfigurationENI ACG-3 300/30 Watt 13.56MHz RF power supply[2]
  • ConfigurationPfeiffer TMH 1000PC Turbo pump with Pfeiffer Turbo Controller[2]
  • ConfigurationRemote gas panel – 4 MFCs[2]
  • RF power supplyENI 300/30 Watt 13.56MHz RF power supply[1]
  • Upper electrode RF power supplyENI ACG-10B 1KW 13.56MHz RF Upper Electrode power supply[1]
  • Turbo pumpLeybold Mag 2000CT Turbo pump with Leybold Mag Drive Controller[1]
  • Turbo pumpPfeiffer TMH 1000PC Turbo pump with Pfeiffer Turbo Controller[2]
  • Gas panelOnBoard gas panel – 4 MFCs[1]
  • Gas panelRemote gas panel – 4 MFCs[2]
  • Electrical208V, 60Hz, 50A 3 phase[1]
  • RF power supplyENI ACG-3 300/30 Watt 13.56MHz RF power supply[2]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What wafer size is this system configured for?

The system is configured for 150 mm (6-inch) wafers.[1][2]

What are the electrical requirements?

The system requires 208 V, 60 Hz, 50 A, 3-phase electrical service.[1][2]

Not publicly documented

The following facts about the Multiplex ICP ASE Advanced Silicon Etch (ASE) are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Multiplex ICP ASE Advanced Silicon Etch (ASE) are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • The control-system platform and OS era of the Multiplex ICP ASE Advanced Silicon Etch (ASE) are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the Multiplex ICP ASE Advanced Silicon Etch (ASE) are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the Multiplex ICP ASE Advanced Silicon Etch (ASE) is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the Multiplex ICP ASE Advanced Silicon Etch (ASE) are on record.

    Answerable by: an OEM parts catalog or a service engineer

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Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]Inventory photo
  2. [2]Inventory photo
  3. [3]waferpedia.com — waferpedia.comwaferpedia.com
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Last updated Oct 5, 2026.

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