Comparison ledger
SUSS MicroTec ACS 300 Gen 2, YES 58TA, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | ACS 300 Gen 2SUSS MicroTec | 58TAYES |
|---|---|---|
| OEM | SUSS MicroTec | YES |
| Category | Thermal / Diffusion | Thermal / Diffusion |
| Wafer size | 300mm | 300mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | SUSS MicroTec ACS 300 | YES 58TA |
| Specifications | ||
| Configuration | Includes:[1] | — |
| Wafer size | System tooling for 200/300 mm semi spec wafer sizes[1] | — |
| OEM | SUSS MicroTec[2] | — |
| Model | ACS 300 Gen 2[3] | — |
| Equipment type | Coater / Developer[1] | — |
| Automation | fully automatic[2] | — |
| Architecture | modular[2] | — |
| Process modes | spin-coating and spray-coating[2] | — |
| Integrated functions | coat, bake, and develop modules[1] | — |
| Operation temperature | — | ambient to 180 °C[4] |
| Image reversal bake throughput | — | 1 load/hour[4] |
| Vacuum bake/vapor prime throughput | — | 2 loads/hour[4] |
| Wafer handling | — | handles wafers up to 300 mm[4] |
| Process control | — | fully programmable process time and temperature[4] |
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