SUSS MicroTec
ACS 300 Gen 2
Wafer size
300mm
Gas delivery
3x Solvent Dispense Nozzle[2]
What it is
The SUSS ACS 300 Gen 2 is an automated coater and developer system. The system processes wafers from two hundred to three hundred millimeters in diameter. The ACS 300 Gen 2 is configured as a coat-bake-develop cluster. The system includes a touch panel PC running the Windows 10 operating system and is compliant with the SECS GEM communication standard.[2][3]
How it works
The ACS 300 Gen 2 uses Gyrset spin coating modules for resist application and developing. The system includes two aqueous develop modules. The temperature stack contains nine hotplates capable of two hundred fifty degrees Celsius with programmable proximity, and three coolplates with programmable proximity. The ACS 300 Gen 2 has two Gyrset spin coating modules, each with four programmable dispense arms. The system includes an edge bead removal system, automated bowl cleaning, and solvent switching. For wafer handling, the ACS 300 Gen 2 uses a dedicated robot for wafer input-output via four Sinfonia SELOP7 loadports and an additional robot for process module handling. The system is equipped with active filterhoods and a CO2 fire suppression kit.[2]
Where it fits in the process flow
General reference — not yet source-verifiedCoater developers are used in the photolithography process sequence. The tool receives wafers after cleaning or surface preparation. After coating and baking, the wafers are transferred to an exposure tool such as a stepper or scanner. After exposure, the wafers return to the developer modules for pattern development. The processed wafers then proceed to subsequent steps such as etching or inspection.
What do the numbers mean?
Wafer handling4
- Additional robot for process module handling[2]
Gas & chemistry2
- 3x Solvent Dispense Nozzle[2]
Control & software1
- Touch Panel PC with Windows10® operating system[2]
Configuration & options21
- Includes:[2]
- Module Coat/Bake/Develop Cluster[2]
- SECS/GEM Compatibility[2]
- Active filterhoods for both I/O and machine[2]
- CO2 Fire Suppression Kit[2]
- Modules include:[2]
- Gyrset Spin Coating/Developing (qty 2)[2]
- Aqueous Develop (qty 2)[2]
- Temperature Stack (qty 1)[2]
- Gyrset Spin Coater Module (qty 2)[2]
- Gyrset Coater[2]
- 4x Programmable Dispense Arm (2 per each module)[2]
- 4x Suss Programmable Dispense System (2 per each module)[2]
- Integrated Back Side Rinse and Splash Ring Rinse[2]
- Edge Bead Removal[2]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What are the key factors affecting temperature uniformity in a thermal/diffusion system?General reference — not yet source-verified
Temperature uniformity depends on the design of the heating elements, the thermal mass of the susceptor or boat, gas flow patterns, and the placement of wafers within the chamber. Advanced systems employ multi-zone heaters and real-time feedback control to minimize gradients across the wafer and from run to run.
How does gas flow influence process results in diffusion furnaces?General reference — not yet source-verified
Gas flow rate and distribution govern the supply of reactive species (e.g., oxygen for oxidation) and the removal of byproducts. Non-uniform flow can cause thickness variations in oxide layers or uneven doping. Most thermal systems use laminar flow injectors and exhaust ports to maintain consistent gas exposure across all wafers.
What safety considerations are important for high-temperature semiconductor equipment?General reference — not yet source-verified
Safety measures include interlock systems to prevent opening the chamber at temperature, robust exhaust to handle flammable or toxic gases (e.g., silane, phosphine), thermal insulation to protect operators, and emergency shutdown procedures. Regular qualification of gas lines and temperature sensors is also essential.
Can thermal/diffusion systems be used for both batch and single-wafer processing?General reference — not yet source-verified
Yes, both batch furnaces (processing multiple wafers at once) and single-wafer rapid thermal processing (RTP) tools exist. Batch furnaces offer high throughput with excellent temperature uniformity, while single-wafer RTP provides fast ramps and reduced thermal budget, making it suitable for advanced nodes with strict thermal constraints.
What maintenance is typically required for thermal/diffusion equipment?General reference — not yet source-verified
Routine maintenance includes cleaning the process chamber to remove deposits (e.g., from oxidation or doping), calibrating temperature sensors, replacing quartz components that become etched or devitrified, and verifying gas flow controllers. Preventive maintenance schedules are critical to preserving process repeatability and extending equipment lifetime.
Not publicly documented
The following facts about the ACS 300 Gen 2 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the ACS 300 Gen 2 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the ACS 300 Gen 2 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the ACS 300 Gen 2 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the ACS 300 Gen 2 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the ACS 300 Gen 2 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Inventory photo
- [3]web.archive.org — suss.com (Mar 27, 2012)web.archive.org
Last updated Sep 29, 2026.
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