Waferpedia

Comparison ledger

ACS 300 Gen 2versusPB12

SUSS MicroTec ACS 300 Gen 2, YES PB12, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
ACS 300 Gen 2SUSS MicroTec
PB12YES
OEMSUSS MicroTecYES
CategoryThermal / DiffusionThermal / Diffusion
Wafer size300mm300mm
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilySUSS MicroTec ACS 300YES PB12
Cited variants—
  • YES-PB8 High Vac Specs[1]
  • YES-PB12 High Vac Specs[1]
Specifications
ConfigurationIncludes:[2]—
Wafer sizeSystem tooling for 200/300 mm semi spec wafer sizes[2]up to 300mm wafers[1]
OEMSUSS MicroTec[3]—
ModelACS 300 Gen 2[4]—
Equipment typeCoater / Developer[2]—
Automationfully automatic[3]—
Architecturemodular[3]—
Process modesspin-coating and spray-coating[3]—
Integrated functionscoat, bake, and develop modules[2]—
Series—PB-HV Series (manual load)[1]
Model designation—PB12 High Vac Specs[1]
Vacuum—high vacuum (10^-5)[1]
Maximum temperature—up to 450°C[1]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]inventory listing
  3. [3]web.archive.orgweb.archive.org
  4. [4]Equipment inventory listing