Comparison ledger
SUSS MicroTec ACS300 Gen3, SUSS MicroTec ELP300 Gen2, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | ACS300 Gen3SUSS MicroTec | ELP300 Gen2SUSS MicroTec |
|---|---|---|
| OEM | SUSS MicroTec | SUSS MicroTec |
| Category | — | — |
| Wafer size | 300mm | 300mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | Gen3 | Gen2 |
| Family | SUSS MicroTec ACS300 Gen3 | SUSS MicroTec ELP300 Gen2 |
| Specifications | ||
| System type | Automated[1] | — |
| Max wafer size | 300 mm[1] | — |
| Process capabilities | Priming, Spin Coating, Baking, Aqueous / Solvent Developing[1] | — |
| Automation | — | Automated[1] |
| Wafer Size | — | up to 300 mm[1] |
| Laser Type | — | Excimer Laser[1] |
| Processes | — | Alignment, Ablation, Laser-Assisted Debonding, Laser Seed Layer Removal[1] |