SUSS MicroTec
ELP300 Gen2
Wafer size
300mm
Optics
Excimer Laser[1]
What is it?
Applications
The ELP300 Gen2 is used for ablation, laser-assisted debonding, and laser seed layer removal.[1]
What do the numbers mean?
Wafer handling1
Optics & imaging2
Configuration & options1
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Not publicly documented
The following facts about the ELP300 Gen2 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the ELP300 Gen2 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the ELP300 Gen2 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the ELP300 Gen2 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the ELP300 Gen2 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the ELP300 Gen2 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]hilpert.ch — hilpert.chhilpert.ch
Last updated Sep 22, 2026.
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