Comparison ledger
SUSS MicroTec AS 8 Spray, YES 1000P, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | AS 8 SpraySUSS MicroTec | 1000PYES |
|---|---|---|
| OEM | SUSS MicroTec | YES |
| Category | Wet Processing / Clean | Wet Processing / Clean |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | 1998 Acquisition |
| Control system | — | — |
| Generation | — | — |
| Family | SUSS MicroTec AS 8 | YES 1000P |
| Specifications | ||
| Configuration | Semi Automatic[1] | Parallel plate[5] |
| Conformal Coating | ensures top edge coverage while avoiding resist accumulation in trenches[1] | — |
| Dual Dispense System | up to two separate spray dispense system to prevent cross-contamination[1] | — |
| Touchscreen Interface | equipped with MMC controller software[1] | — |
| Programmable Recipes | all spray and cleaning parameters can be customized and saved[1] | — |
| Operation type | Semi-automatic / semi-automated; manufacturer also describes it as a manual spray coater[1] | — |
| Substrate size | Substrates up to 200mm or 300mm in diameter, and square substrates up to 6" edge length[1] | — |
| Nozzle configuration | Dual Dispense System: up to two separate spray dispense systems to prevent cross-contamination[1] | — |
| Control interface | Touchscreen interface equipped with MMC controller software[1] | — |
| Recipe capability | Programmable recipes: all spray and cleaning parameters can be customized and saved[1] | — |
| Spray nozzle range | Nozzle adjustment from 67.5 mm to 107.5 mm; z-axis adjustment range up to 45 mm[2] | — |
| Spray axis speed | Spray axis velocities up to 500 mm/s and acceleration up to 9 m/s²[2] | — |
| Chuck rotation | Chuck rotation up to 1,000 rpm[2] | — |
| Dual-nozzle / single-nozzle substrate support | Dual-nozzle mode for Ø150 mm and Ø200 mm substrates; single-nozzle mode for Ø3", Ø100 mm, Ø150 mm and Ø200 mm substrates[2] | — |
| Solvent nozzle | Separate solvent nozzle for precise, flexible cleaning and fast recipe execution[2] | — |
| Heated chuck | Heated chuck option available[2] | — |
| Maximum substrate size | 8 inch[3] | — |
| Wafer sizes | Wafer sizes from pieces to 200mm[3] | — |
| Resist types | Common resists sprayed are SU-8, S1800 and various AZ formulations[3] | — |
| Topography capability | Capable of coating 90° corners, KOH etched cavities, Through Silicon Vias (TSVs) or lenses with topographies ranging from a few micron to 600µm or more[3] | — |
| Low viscosity support | Low Viscosity Solutions[1] | — |
| Model | — | 1000P[4] |
| System type | — | Plasma cleaning system[4] |
| Shelf configuration | — | Four 16 x 16 inch shelves[4] |
| Total capacity | — | 1024 square inches[4] |
| Control system | — | PLC driven with plain English real time process readout and diagnostics in the event of system abort[4] |
| Number of shelves | — | 4[4] |
| Shelf size | — | 16 x 16 inches[4] |
| Power | — | 1000 W[5] |
| Operation modes | — | Active, RIE, Downstream[4] |
| Sample size range | — | From smallest semiconductor chip to large flat panels[4] |
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