Waferpedia

Comparison ledger

SS 20 Automatic DicingversusDFD 6341

Accretech SS 20 Automatic Dicing, Disco DFD 6341, side by side. Every value shown is drawn from the cited encyclopedia entries.

Documented as functional equivalents— Same function class: Dicing & Grinding, null[1]
Side-by-side comparison of selected equipment models
Attribute
OEMAccretechDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAccretech SS 20 Automatic DicingDisco DFD 6341
Cited variants—
Specifications
Max workpiece size (round wafers)250 mm[3]—
Max workpiece size (square wafers)250 mm[3]—
Spindle speed (standard)60,000 rpm[3]—
Spindle speed (optional)80,000 rpm[3]—
Display17-inch touchscreen[3]—
Kerf check functionYes[3]—
Maximum wafer diameter (circular)250 mm[3]—
Maximum square wafer size250 mm x 250 mm[3]—
Maximum sample thickness (tape-mounted)1 mm[4]—
Compatible wafer sizes (reported at one facility)up to 8 inches (200 mm) diameter[4]—
Phase—3 Phase[5]
Configuration—380-415 Voltage[5]
Electrical Phase—3 Phase[5]
Supply Voltage—380-415 V[5]
Wiring Configuration—3 Wire + Ground[5]
Frequency—50/60 Hz[5]
Vintage (Year of Manufacture)—2017[5]
OEM—Disco[5]
Model—DFD 6341[5]
Equipment type—Dicer[5]
Power—3 phase[5]
Voltage—380-415 Voltage[5]
Electrical connection—3 Wire + Ground[5]
Vintage—2017[5]

Plan your fab

Building a Dicing & Grinding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (6)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]accretech.euaccretech.eu
  3. [3]accretech.euaccretech.eu
  4. [4]purdue.atlassian.netpurdue.atlassian.net
  5. [5]inventory listing
  6. [6]Equipment inventory listing