Accretech
SS 20 Automatic Dicing
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
How it works
The SS20PLUS uses a precision air spindle to rotate the blade, and the machine performs cutting and groove processing. The SS20PLUS uses image processing alignment and can work automatically from preset data.[7]
The SS20PLUS includes cutting, blade dressing, auto-focus, alignment, kerf check, self-diagnosis, and maintenance functions. The SS20PLUS also uses X, Y, Z, and theta axes in the cutting section.[7]
Where it fits in the process flow
The SS20 belongs in wafer singulation or wafer separation after front-end device formation and before individual die handling. The machine supports cutting of semiconductor and MEMS wafers into separate chips or devices.[2]
The SS20PLUS is intended for dicing thick substrates and hard-to-machine materials, including glass, ceramics, and wafers up to 200 mm in diameter. The SS20 also supports square wafers up to 250 mm.[3][1]
Applications
The SS20 family is used for wafer dicing and grooving work on semiconductor materials. The SS20PLUS is also applied to thick substrates and hard materials such as glass and ceramics.[3][1]
What do the numbers mean?
Wafer handling5
Control & software1
Configuration & options6
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| SS20PLUS | — | — | Designed for hard materials; supports wafers up to 200 mm (round) and 250 mm (square); spindle power 2.5 kW, max spindle speed 30,000 rpm; compatible with blades from 76 mm to 130 mm; Y-axis positioning accuracy ±0.002 mm; dimensions 890 × 1,090 × 1,625 mm; weight 832 kg. | accretech.eu[3] |
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- Disco DAD 340 Wafer— Same function class: Dicing & Grinding, nullCompare in depthsource[4]
- Disco DFD 6341— Same function class: Dicing & Grinding, nullCompare in depthsource[5]
- Disco DAD 3350 Automatic Dicing— Same function class: Dicing & Grinding, nullCompare in depthsource[6]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What is the maximum wafer size the Accretech SS 20 can handle?
The Accretech SS 20 can handle round wafers up to 8 inches in diameter and square wafers up to 250 mm on a side.[1][2]
What spindle speed does the SS20 support?
The spindle can reach up to 60,000 rpm, with an optional upgrade to 80,000 rpm.[1]
What is the maximum thickness of material the SS20 can cut?
Under standard operation, the SS20 can cut materials up to 1 mm thick. Thicker materials require special handling and blades.[2]
What type of user interface does the SS20 have?
The SS20 uses a 17-inch touch screen with a modern graphical user interface for controlling the machine and setting recipes.[1]
What blade types are available for the SS20?
Blade options include resin bond blades for glass and ceramics, metal bond blades for glass and quartz, ultra-hard metal blades for non-ferrous metals, hub blades for silicon, and nickel bond blades for wafers and substrates.[1]
Not publicly documented
The following facts about the SS 20 Automatic Dicing are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the SS 20 Automatic Dicing are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the SS 20 Automatic Dicing are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the SS 20 Automatic Dicing are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the SS 20 Automatic Dicing is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the SS 20 Automatic Dicing are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (8)Every fact above is drawn from these public sources
- [1]accretech.eu — accretech.euaccretech.eu
- [2]purdue.atlassian.net — purdue.atlassian.netpurdue.atlassian.net
- [3]accretech.eu — accretech.euaccretech.eu
- [4]Equipment inventory listing
- [5]web.archive.orgweb.archive.org
- [6]web.archive.orgweb.archive.org
- [7]https://www.gtsaz.com/downloads/specs_ss20-plus.pdf — gtsaz.comgtsaz.com
- [8]Equipment inventory listing
Last updated Sep 27, 2026.
Compare with similar tools
View all →
The Disco DAD 3350 is an automatic dicing saw.
The Disco DAD 340 Wafer is a wafer dicing saw used in semiconductor back-end processing.
The Disco DFD 6341 is a dicer identified with 3-phase, 380-415 V, 3 wire + ground, 50/60 Hz power requirements.
The Lapmaster Model 15 is a bench-mounted unit with a rigid, lightweight, cast aluminum base, of the 'ring lapper' configuration, enabling high standards of flatness and surface finish.
