Comparison ledger
Axcelis 200 ACU, Lam Research TCP 9600 Metal, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 200 ACUAxcelis | TCP 9600 MetalLam Research |
|---|---|---|
| OEM | Axcelis | Lam Research |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Axcelis NV GSD 200 | Lam Research TCP 9600 |
| Specifications | ||
| Configuration | Parts Machine[1] | SMIF[5] |
| Manufacturer | Axcelis[1] | — |
| Model | 200 ACU[1] | — |
| Tool type | Asher[1] | — |
| Wafer size | 200mm[3] | — |
| Serial number | AU6A356AH[3] | — |
| Computer system | M 200 PC, M 200[4] | — |
| Part number | SC 4572 A[4] | — |
| Volts | 208[4] | — |
| Amps | 30[4] | — |
| Equipment type | Asher[1] | — |
| Wafer configuration | 8 inch[2] | — |
| Supported wafer sizes | — | 150mm (6 inch) and 200mm[6] |
| Process pressure range | — | 0 - 100 mTorr[7] |
| Top electrode power | — | 0 - 1250 W[7] |
| Lower electrode power | — | 0 - 1200 W[7] |
| Process temperature | — | 55 °C[7] |
| Process gases | — | Cl2, BCl3, HBr, SF6, CF4, Ar, N2, O2, He[7] |
| Endpoint detection | — | Adjustable monochromator[7] |
| Wafer clamp | — | Electrostatic chuck (ESC) with helium backside cooling[8] |
| Electrode gap | — | Fixed gap 8 inch TCP coil[8] |
| Number of RF generators | — | 3 (AE RFG 1250)[8] |
| Power supply requirements | — | 208V, 80A, 3-Phase, 50/60Hz[8] |
| DSQ strip module | — | Included[7] |
| Software version | — | Envision 1.6.1-012[8] |
| Aluminum etch rate | — | > 8000 Å/min[6] |
| Aluminum non-uniformity | — | +/- 15%[6] |
| System uptime | — | Typically > 85%[6] |
| Mean time to change (MTTC) | — | 12 hours[6] |
| Mean time between failures (MTBF) | — | > 125 hours[6] |
| Mean time to repair (MTTR) | — | < 4 hours[6] |
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