Waferpedia

Comparison ledger

DFS 8910 Surface Planarizationversus12 Lapper

Disco DFS 8910 Surface Planarization, Lapmaster 12 Lapper, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
12 LapperLapmaster
OEMDiscoLapmaster
CategoryCMPCMP
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco DFS 8910 Surface Planarization—
Specifications
Outside plate diameter—12 inches[1]
Lapping Speed Range—0 to 60 rpm[2]
Wafer Size Compatibility—4 inches or smaller[1]
Input Voltage—110 V[1]
Frequency—60 Hz[1]
Phase—1[1]
Number of Rings—3[1]
Number of Weights—3[1]
Includes Slurry System—Yes[1]
Includes Timer—Yes[1]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]jmind.comjmind.com
  2. [2]etd.ohiolink.eduetd.ohiolink.edu