Tool family
Accretech SS20 is a semi-automatic dicing machine designed for wafer separation, supporting wafers up to 250 mm and square wafers.
Cited variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| SS20PLUS | — | — | Designed for hard materials; supports wafers up to 200 mm (round) and 250 mm (square); spindle power 2.5 kW, max spindle speed 30,000 rpm; compatible with blades from 76 mm to 130 mm; Y-axis positioning accuracy ±0.002 mm; dimensions 890 × 1,090 × 1,625 mm; weight 832 kg. | accretech.eu[1] |