Accretech
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The Accretech UF 3000 is a wafer prober for testing integrated circuits on wafers. The Accretech UF 3000 supports tri-temp operation with a temperature range of -40 to 150°C. The Accretech UF 3000 is manufactured by Accretech, which is located in Tokyo, Japan.[1][2]
A prober positions a wafer on a movable chuck and brings it into alignment with a probe card, which contains an array of fine probes that make electrical contact with the wafer's bond pads.
The UF 3000 is used in the wafer sort (also called die sort or probe) stage of semiconductor manufacturing, which occurs after wafer fabrication and before assembly and packaging.
During wafer sort, the prober works in conjunction with a semiconductor test system (automated test equipment) to electrically test each die on the wafer, identifying known good dies (KGD) and eliminating defective ones.
The UF 3000 is applied in the electrical testing of integrated circuits at the wafer level, across a wide range of device types and technologies.
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The following facts about the UF 3000 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the UF 3000 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the UF 3000 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the UF 3000 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the UF 3000 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the UF 3000 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 1, 2026.