Accretech
UF 3000 EX-e
What it is
General reference — not yet source-verifiedWafer probers are used in semiconductor manufacturing to electrically test individual die on a wafer before dicing. The machine positions the wafer relative to a probe card and makes temporary electrical contacts to measure device parameters.
How it works
General reference — not yet source-verifiedThe prober uses a movable chuck that holds the wafer and aligns it in X, Y, and theta under a microscope or camera system. The probe card, mounted above the chuck, contains fine needles that contact the wafer's bond pads. Once aligned, the chuck lifts the wafer to make contact, and the connected tester applies signals and measures responses. The machine then steps the wafer to the next die location automatically.
What do the numbers mean?
Power & electrical2
- Single Phase[1]
Wafer handling2
- Low noise hot chuck[1]
Control & software3
Configuration & options11
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What types of measurements can be performed with machines of this class?General reference — not yet source-verified
Such systems can perform a wide range of electrical measurements including I-V curves, capacitance, gain, leakage current, and other parameters required for device characterization at the wafer level.
How is probe positioning accuracy achieved in this class of equipment?General reference — not yet source-verified
Accuracy is achieved through precision mechanics, optical alignment systems, and closed-loop feedback control to ensure reliable contact with device pads while minimizing drift.
What factors affect the throughput of a test and probe system?General reference — not yet source-verified
Throughput is influenced by wafer handling speed, probe approach and contact speed, the number of parallel test channels, and the complexity of test sequences.
Can these systems handle temperature-dependent testing?General reference — not yet source-verified
Yes, many machines of this class include an integrated temperature-controlled chuck that allows testing over a range of temperatures to assess device performance under different thermal conditions.
What are key considerations for integrating such a system into a production line?General reference — not yet source-verified
Key considerations include compatibility with existing wafer handling, alignment with test equipment, automation software, and support for various wafer sizes and device geometries.
Not publicly documented
The following facts about the UF 3000 EX-e are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the UF 3000 EX-e are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the UF 3000 EX-e are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the UF 3000 EX-e are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the UF 3000 EX-e are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the UF 3000 EX-e is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (5)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Inventory photo
- [3]Inventory photo
- [4]inventory listing
- [5]Equipment inventory listing
Last updated Sep 30, 2026.
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