Waferpedia

Advantest

B 6700 S

Test & ProbeAdvantest B 6700 S family
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Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

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What it is

The Advantest B 6700 S is a semiconductor test and probe system.[1][2]

How it works

General reference — not yet source-verified

A test system such as the B 6700 S typically comprises a test head that houses pin electronics and a prober that positions a wafer under a probe card. The probe card contacts the device under test, and the tester applies stimulus signals while measuring output responses.

The system executes test programs that define voltage, current, timing, and pattern sequences to validate functionality and parametric performance of each die.

Where it fits in the process flow

General reference — not yet source-verified

The Advantest B 6700 S is used in semiconductor manufacturing after wafer fabrication and before packaging, during the wafer sort or probe step. At this stage, individual die are tested to identify known good die and to bin devices by performance grade.

The equipment operates in a cleanroom environment and is fed wafers from the fab output. After testing, wafers proceed to dicing and packaging, or in some flows to further processing such as burn-in.

Applications

General reference — not yet source-verified

Such test systems are employed in both development and high-volume production environments to ensure device quality and to gather statistical data for yield improvement.

What do the numbers mean?

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Where are the manuals?

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Not publicly documented

Field notes

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Frequently asked questions

What is the manufacturer of the B 6700 S?

The manufacturer is Advantest.[1][2]

What equipment category does the B 6700 S belong to?

The B 6700 S is categorized as a test and probe system.[2]

Not publicly documented

The following facts about the B 6700 S are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No specifications for the B 6700 S are on record.

    Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the B 6700 S are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the B 6700 S are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the B 6700 S are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the B 6700 S are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

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Sources & citations

Sources (2)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]B 6700 S — Advantest | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
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Last updated Sep 27, 2026.

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