AJA
CT1210
The AJA CT1210 is a cylindrical target magnetron sputtering source from AJA International. The AJA CT1210 is used for 3D sputtering where substrates are inserted into the target or cathode.[1]
What it is
The AJA CT1210 is a cylindrical target magnetron used for three-dimensional sputtering.[1][3][2]
How it works
Where it fits in the process flow
Applications
- 3D sputtering
What do the numbers mean?
Wafer handling2
Configuration & options3
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What types of materials can be deposited?General reference — not yet source-verified
Sputter deposition can deposit a wide range of materials, including metals, alloys, insulators, and some compounds, depending on the target material and process conditions.
What substrates are compatible?General reference — not yet source-verified
Substrates such as silicon wafers, glass, ceramics, and polymers can be used, provided they are vacuum compatible and prepared appropriately.
What is the typical vacuum level required?General reference — not yet source-verified
A base pressure in the high vacuum range is needed to minimize contamination and achieve good film quality.
How is film thickness controlled?General reference — not yet source-verified
Thickness is controlled by calibration of deposition rate and time, often monitored in situ using quartz crystal microbalances or optical methods.
What are common maintenance requirements?General reference — not yet source-verified
Routine maintenance includes cleaning the chamber, replacing targets when depleted, and checking seals and pumps to maintain vacuum integrity.
Not publicly documented
The following facts about the CT1210 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the CT1210 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the CT1210 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the CT1210 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the CT1210 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the CT1210 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]web.archive.org — web.archive.orgweb.archive.org
- [2]web.archive.org — web.archive.orgweb.archive.org
- [3]Batch Coater Sputter Systems — web.archive.orgweb.archive.org
Last updated Oct 4, 2026.
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