Applied Materials
Mirra
Applied Materials Mirra is a chemical mechanical polisher. Applied Materials Mirra is configured for 8 inch wafers. Applied Materials Mirra includes Platen 3 for wafer buff.[1][2][3][4]
What it is
General reference — not yet source-verifiedThe Applied Materials Mirra is a chemical mechanical polisher used in semiconductor manufacturing. The Mirra combines mechanical action with slurry-assisted chemical action to planarize wafer surfaces.
How it works
General reference — not yet source-verifiedA chemical mechanical polisher presses a wafer against a rotating pad while a slurry flows across the polishing interface. The combined chemical and abrasive action removes material and reduces topography across the wafer surface.
Where it fits in the process flow
General reference — not yet source-verifiedA CMP tool sits after deposition and other film-forming steps when the wafer surface must be flattened before later lithography or integration steps. CMP is used when topography control is needed for continuing device fabrication.
Applications
General reference — not yet source-verifiedChemical mechanical polishing is used to planarize interconnect and insulating films in semiconductor fabrication. The method is applied where a flat surface is needed for subsequent patterning and layer build-up.
Why won't it start?
Documented failure modes, common issues, and field considerations.
- Known missing parts listed in one source: platen, hard drive, rotary union, 3 UPA regulators, and 2 UPA boards.
What do the numbers mean?
Wafer handling9
Gas & chemistry2
Control & software4
Configuration & options29
- 3 Polish Platens:[1]
- Platen1 - STD polish[1]
- Platen2 - STD Polish[1]
- 4 - Tungsten + Polish Heads[1]
- Entegris Flow Controllers[1]
- Upgrades:[1]
- Waterfall Cable[1]
- Remote UPA[1]
- Tungsten[2]
- Platen 1 - STD polish[2]
- Platen 2 - STD Polish[2]
- Waterfall Cable upgrade[2]
- Remote UPA upgrade[2]
- Dielectric[3]
- 4 Titan Polish Heads[3]
- McMillan Flow Controllers[3]
Vintage & configurations
- 2000Production start[5]
Applied Materials shipped the 500th Mirra CMP system on 2000-02-22.
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| Applied Materials Mirra CMP | — | 1999 | Sources list configurations including Tungsten or Dielectric process use, software MP2B6.2_28 / MP2B6.2 28, three polish platens, and different polish head / flow controller descriptions. | Equipment inventory listing[1] |
| Mirra | — | 1999 | — | Equipment inventory listing[1] |
| Tungsten | — | 1999 | Listed with tungsten processing; one source also states 4 tungsten polish heads and one notes tungsten + polish heads. | Equipment inventory listing[1] |
| Dielectric | — | 1999 | Listed with dielectric processing. | Equipment inventory listing[3] |
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What does a CMP machine do in semiconductor processing?General reference — not yet source-verified
It removes material from a wafer surface in a controlled way to make the surface flatter and more uniform.
Why combine chemistry and polishing in one process?General reference — not yet source-verified
The chemical action changes the surface so the mechanical polishing can remove material more effectively and with better planarity.
Where is CMP used in the process flow?General reference — not yet source-verified
It is used after steps that create films or topography, when the wafer needs to be leveled before later processing.
What kinds of materials are processed by this class of machine?General reference — not yet source-verified
Machines of this class are used on a range of wafer films, including dielectric and metal layers, depending on the process recipe.
What is the main result of CMP?General reference — not yet source-verified
The main result is a smoother, flatter wafer surface with reduced topography.
Not publicly documented
The following facts about the Mirra are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
The control-system platform and OS era of the Mirra are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the Mirra is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the Mirra are on record.
Answerable by: an OEM parts catalog or a service engineer
No publicly hosted manuals, SOPs, or datasheets for the Mirra are on record.
Answerable by: university cleanroom staff or an OEM application specialist
Sources & citations
Sources (5)Every fact above is drawn from these public sources
- [1]inventory listing
- [2]Inventory photo
- [3]Inventory photo
- [4]Equipment inventory listing
- [5]web.archive.org — appliedmaterials.com (Mar 5, 2000)web.archive.org
Last updated Oct 9, 2026.
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