Canon
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A lithography stepper aligns a mask to the wafer surface and exposes a small field in repeated steps across the wafer.
An i-line lithography system uses ultraviolet exposure from the mercury i-line region for pattern transfer in photoresist processes.
A lithography stepper sits early in the wafer fabrication flow, after surface preparation and photoresist coating and before development and downstream pattern transfer steps.
The Canon FPA 3030 i 5 + i-Line is applied to wafer-level lithography on 6-inch substrates.[1]
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The following facts about the FPA 3030 i 5 + i-Line are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the FPA 3030 i 5 + i-Line are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the FPA 3030 i 5 + i-Line are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the FPA 3030 i 5 + i-Line are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the FPA 3030 i 5 + i-Line are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the FPA 3030 i 5 + i-Line is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Sep 26, 2026.
Brooks 017-0146-01 is a prealigner manufactured by Brooks.
The EVG 101 is an advanced resist processing system for spin or spray coating and developing of wafers up to 300 mm.