Dektak
6M
The Dektak 6M Stylus Profilometer is a film step-height measurement tool capable of measuring steps from 260 microns down to 10 nm. The Dektak 6M is equipped with a 25-micron-radius, high-aspect-ratio stylus. The Dektak 6M has a maximum acceptable sample size of 6 inches.[1]
Wafer size
6"
Optics
Steps from 260 microns down to 10 nm[1]
What it is
The Dektak 6M is a stylus profilometer used for surface metrology in a cleanroom environment. The instrument is classified as cleanroom instrumentation and as a surface analysis tool. The Dektak 6M is a film step-height measurement tool capable of measuring steps from 260 microns down to 10 nm.[1][2]
The system can also be used to profile surface topography and measure surface roughness in the nanometer range. The system is currently equipped with a 25-micron-radius, high-aspect-ratio stylus. Maximum acceptable sample size is 6 inches.[1]
How it works
General reference — not yet source-verifiedStylus profilometers operate by bringing a mechanical stylus into contact with the sample surface and translating the sample or the stylus across a programmed scan length. The vertical motion of the stylus as it follows the surface is converted into a height profile, which is used to determine step heights, roughness parameters, and general topography.
Applications
General reference — not yet source-verifiedStylus profilometry of this class is commonly applied to characterize photoresist steps, deposited metal and dielectric films, etched trenches, and other surface features produced during nanofabrication. The technique provides a direct contact-based measurement of vertical dimensions across a line scan.
- Film step-height measurement
- Surface topography profiling
- Surface roughness measurement
What do the numbers mean?
Optics & imaging2
Dimensions & facilities1
Configuration & options9
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What types of chemicals are typically used in wet processing equipment?General reference — not yet source-verified
Common chemicals include acids, bases, solvents, and etchants such as hydrofluoric acid, sulfuric acid, ammonium hydroxide, and isopropyl alcohol. Deionized water is used for rinsing.
How are substrates handled in wet processing tools?General reference — not yet source-verified
Substrates are typically handled by robotic arms or conveyor systems, often in cassettes or carriers. The equipment maintains cleanliness through filtered fluids, sealed chambers, and controlled environments to minimize particle contamination.
What are the key process parameters to control in wet processing?General reference — not yet source-verified
Important parameters include chemical concentration, temperature, immersion time, agitation, and rinse quality. Consistent control ensures uniform etching and effective cleaning.
Not publicly documented
The following facts about the 6M are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 6M are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 6M are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 6M are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 6M are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 6M is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]tmi.utexas.edu — tmi.utexas.edutmi.utexas.edu
- [2]Instrumentation — tmi.utexas.edutmi.utexas.edu
- [3]Instrumentation — tmi.utexas.edutmi.utexas.edu
Last updated Oct 3, 2026.
Compare with similar tools
View all →
The Oxford PRS900 is a computer-driven barrel reactor dedicated to dry resist stripping.
The Glen/YES 1000FP is a plasma cleaning system designed to accept a range of shelf sizes for changing flat panel industry needs.
The 1000P is a plasma cleaning system with four 16 x 16 inch shelves and a total capacity of 1024 square inches.
