Disco
DAD 3350 Automatic Dicing
The Disco DAD 3350 is an automatic dicing saw. The Disco DAD 3350 has a maximum cutting diameter of 250 mm. The Disco DAD 3350 is equipped with a 1.8 kW spindle.[1][2][3][4][5]
How it works
The DAD 3350 uses a high-speed rotating spindle carrying a dicing blade to cut through the workpiece. The saw supports optical communication V-grooves, glass, and printed circuit boards with high precision and stable performance.[5]
What can it run?
Process applications and technology nodes documented for this tool.
- optical communication V-grooves
- glass
- printed circuit boards
What do the numbers mean?
Power & electrical10
Optics & imaging2
- Supports optical communication V-grooves, glass, and printed circuit boards with high precision & stable performance[5]
Control & software2
- Software vs. 1.43[4]
Configuration & options12
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- Veeco ADS 800 Dicing— Same function class: Dicing & Grinding, nullCompare in depthsource[15]
- Accretech SS 20 Automatic Dicing— Same function class: Dicing & Grinding, nullCompare in depthsource[15]
- ADT 8020 Auto Twin Dicing— Same function class: Dicing & Grinding, nullCompare in depthsource[15]
- Accretech AD 3000 T Dicing— Same function class: Dicing & Grinding, nullCompare in depthsource[15]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Maximum PowerAC 200 V[1]
- Configuration50/60 Hz[1]
- Phase3 Phase[1]
- ConfigurationAC 200 V[4]
- Configuration200-240 V[5]
- ConfigurationEquipped with 1.8 kW spindle[5]
- Voltage200 VAC[13]
- Power specificationAC 200 V, 50/60 Hz, 3-phase[1]
- Alternate power specification200–240 V, 50/60 Hz, 3-phase[5]
- Spindle power1.8 kW[5]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What is the maximum substrate diameter the DAD 3350 can cut?
The DAD 3350 is capable of cutting up to 250 mm diameter substrates.[5]
What is the spindle power of the DAD 3350?
The DAD 3350 is equipped with a 1.8 kW spindle.[5]
What types of materials can the DAD 3350 cut?
The DAD 3350 supports cutting of optical communication V-grooves, glass, and printed circuit boards with high precision and stable performance.[5]
Not publicly documented
The following facts about the DAD 3350 Automatic Dicing are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DAD 3350 Automatic Dicing are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DAD 3350 Automatic Dicing are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DAD 3350 Automatic Dicing are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DAD 3350 Automatic Dicing are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DAD 3350 Automatic Dicing is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (15)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Inventory photo
- [3]Inventory photo
- [4]Inventory photo
- [5]Inventory photo
- [6]Inventory photo
- [7]Inventory photo
- [8]Inventory photo
- [9]Inventory photo
- [10]Inventory photo
- [11]Inventory photo
- [12]Inventory photo
- [13]inventory listing
- [14]inventory listing
- [15]DAD3350 | 切割机 | 产品信息 | DISCO CORPORATION — disco.co.jp (Apr 11, 2026)web.archive.org
Last updated Sep 22, 2026.
Compare with similar tools
View all →
The ADT 8020 Auto Twin Dicing is a fully automatic twin dicing system for 8-inch workpieces.
The Accretech AD 3000 T Dicing is a fully automatic dicing saw for 300 mm wafers.
The Veeco ADS 800 Dicing System is a dicing system configured with a 220 VAC, 3-phase, 50/60 Hz, 30 Amp power requirement and includes motion, control, vision, and coolant delivery components.
Accretech SS20 is a semi-automatic dicing machine designed for wafer separation, supporting wafers up to 250 mm and square wafers.
