Disco
DAG 810 Back
The Disco DAG 810 is a back grinder used for semiconductor wafer backside grinding. The Disco DAG 810 supports 6-inch wafers. The Disco DAG 810 is a 3-phase machine operating at 50/60 Hz.[1][2][3][4]
What it is
How it works
General reference — not yet source-verifiedIn a typical back grinding process, the wafer is mounted on a dicing tape stretched across a frame and placed on a vacuum chuck. A grinding wheel containing diamond abrasive particles is brought into contact with the back side of the wafer while coolant is applied to remove heat and debris. The grinding wheel moves across the wafer in a programmed pattern, progressively reducing thickness to a target value. An in-situ thickness measurement system monitors the process and signals when the final thickness is reached.
Where it fits in the process flow
General reference — not yet source-verifiedThe back grinding process is performed after front-end fabrication steps such as photolithography, etching, and metallization are complete. Wafers enter the back grinder from a cassette of processed wafers and exit at a thinned state. The thinned wafers then proceed to dicing, where they are cut into individual dies, followed by packaging or direct chip attachment.
Applications
General reference — not yet source-verifiedBack grinding is used to produce thin wafers for a variety of semiconductor packages, including ball grid arrays, quad flat packages, and stacked die configurations. Thinned wafers allow for better thermal dissipation and lower profile packages, and they are essential for multi-chip modules and memory stacks.
What do the numbers mean?
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- Strasbaugh 7 AF Back— Same function class: Dicing & Grinding, nullCompare in depthsource[1]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the DAG 810 Back are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DAG 810 Back are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DAG 810 Back are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DAG 810 Back are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DAG 810 Back are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DAG 810 Back is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (7)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Inventory photo
- [3]Equipment inventory listing
- [4]inventory listing
- [5]Inventory photo
- [6]Inventory photo
- [7]Inventory photo
Last updated Oct 2, 2026.
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