Strasbaugh
The Strasbaugh 7 AF Back Grinder is a semiconductor back-grinding tool used to thin wafers. The Strasbaugh 7 AF Back Grinder can process 8-inch silicon wafers. The Strasbaugh 7 AF Back Grinder requires 3-phase electrical power at 208 V, 230 V, or 480 V.[1]

Thinned wafers are used in memory, logic, and power devices where reduced thickness is necessary for thermal management or form factor.
1999 Vintage
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
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The Strasbaugh 7 AF can run 8-inch silicon wafers.[1]
The Strasbaugh 7 AF is a three-phase machine available with 208 V, 230 V, or 480 V input.[4][5][1]
The grinding area section weighs 5200 lb and the handling area section weighs 2300 lb.[1]
The following facts about the 7 AF Back are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented variants, configuration options, or revision breakpoints of the 7 AF Back are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 7 AF Back are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 7 AF Back are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 7 AF Back is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 7 AF Back are on record.
Answerable by: an OEM parts catalog or a service engineer
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Last updated Oct 11, 2026.
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